DM

Daniel Maurer

Infineon Technologies Ag: 11 patents #789 of 7,486Top 15%
SA Selfrag Ag: 2 patents #4 of 17Top 25%
📍 Feld am See, AT: #1 of 2 inventorsTop 50%
Overall (All Time): #341,421 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
11787686 Method for processing a layer structure and microelectromechanical component Andre Brockmeier, Wolfgang Friza 2023-10-17
11616032 Semiconductor device having alignment pads and method of manufacturing the same Christof Altstaetter, Thomas Beyreder, Oliver Blank, Jürgen Bostjancic, Andreas Kleinbichler +2 more 2023-03-28
11180362 Method for processing a layer structure and microelectromechanical component Andre Brockmeier, Wolfgang Friza 2021-11-23
10766766 Method for processing a layer structure and microelectromechanical component Andre Brockmeier, Wolfgang Friza 2020-09-08
10710874 Micromechanical structure and method for manufacturing the same Tobias Frischmuth, Guenter Denifl, Thomas Grille, Ursula Hedenig, Markus Kahn +2 more 2020-07-14
10106398 Micromechanical structure comprising carbon material and method for fabricating the same Ulrich Schmid, Tobias Frischmuth, Peter Irsigler, Thomas Grille, Ursula Hedenig +3 more 2018-10-23
10081533 Micromechanical structure and method for fabricating the same Ulrich Schmid, Tobias Frischmuth, Peter Irsigler, Thomas Grille, Ursula Hedenig +2 more 2018-09-25
9511560 Processing a sacrificial material during manufacture of a microfabricated product Guenter Denifl, Thomas Grille, Joachim Hirschler, Markus Kahn 2016-12-06
9439017 Method for manufacturing a plurality of microphone structures, microphone and mobile device Ursula Hedenig, Thomas Grille, Peter Irsigler, Soenke Pirk, Andre Brockmeier 2016-09-06
9212045 Micro mechanical structure and method for fabricating the same Ulrich Schmid, Tobias Frischmuth, Peter Irsigler, Thomas Grille, Ursula Hedenig +2 more 2015-12-15
8871550 Method for processing a wafer at unmasked areas and previously masked areas to reduce a wafer thickness Thomas Grille, Ursula Hedenig, Martin Zgaga 2014-10-28
8125129 Working electrode for an electrodynamic fragmenting installation Reinhard Müller-Siebert 2012-02-28
8071876 Method for grounding a high voltage electrode Christoph Anliker, Reinhard Müller-Siebert 2011-12-06
5213183 Control device for a valve with a spiral spring 1993-05-25