Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672716 | Integrated circuit substrate and method for manufacturing the same | Michael Roesner, Gudrun Stranzl, Manfred Engelhardt | 2020-06-02 |
| 10157765 | Methods for processing a semiconductor workpiece | Gudrun Stranzl, Rainer Leuschner, Bernhard Goller, Bernhard Boche, Manfred Engelhardt +5 more | 2018-12-18 |
| 10020264 | Integrated circuit substrate and method for manufacturing the same | Michael Roesner, Gudrun Stranzl, Manfred Engelhardt | 2018-07-10 |
| 10005659 | Method for simultaneous structuring and chip singulation | Thomas Grille, Ursula Hedenig, Michael Roesner, Gudrun Stranzl | 2018-06-26 |
| 9741618 | Methods of forming semiconductor devices | Gudrun Stranzl, Markus Kahn, Guenter Denifl | 2017-08-22 |
| 9708182 | Methods for producing a cavity within a semiconductor substrate | Andreas Behrendt, Kai-Alexander Schreiber, Sokratis Sgouridis, Bernhard Winkler | 2017-07-18 |
| 9673096 | Method for processing a semiconductor substrate and a method for processing a semiconductor wafer | Joachim Hirschler, Michael Roesner, Markus Heinrici, Gudrun Stranzl, Martin Mischitz | 2017-06-06 |
| 9610543 | Method for simultaneous structuring and chip singulation | Thomas Grille, Ursula Hedenig, Michael Roesner, Gudrun Stranzl | 2017-04-04 |
| 9496193 | Semiconductor chip with structured sidewalls | Michael Roesner, Gudrun Stranzl, Martin Sporn, Tobias Schmidt | 2016-11-15 |
| 9481563 | Semiconductor device having a micro-mechanical structure | Manfred Engelhardt | 2016-11-01 |
| 9257342 | Methods of singulating substrates to form semiconductor devices using dummy material | Gudrun Stranzl, Markus Kahn, Guenter Denifl | 2016-02-09 |
| 9139427 | Methods for producing a cavity within a semiconductor substrate | Andreas Behrendt, Kai-Alexander Schreiber, Sokratis Sgouridis, Bernhard Winkler | 2015-09-22 |
| 9006109 | Semiconductor devices and methods for manufacturing semiconductor devices | Manfred Engelhardt | 2015-04-14 |
| 8871550 | Method for processing a wafer at unmasked areas and previously masked areas to reduce a wafer thickness | Thomas Grille, Ursula Hedenig, Daniel Maurer | 2014-10-28 |
| 8772133 | Utilization of a metallization scheme as an etching mask | Manfred Engelhardt, Karl Mayer, Gudrun Stranzl | 2014-07-08 |
| 8748297 | Methods of forming semiconductor devices by singulating a substrate by removing a dummy fill material | Gudrun Stranzl, Markus Kahn, Guenter Denifl | 2014-06-10 |