Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8709876 | Electronic device | Holger Torwesten | 2014-04-29 |
| 8637379 | Device including a semiconductor chip and a carrier and fabrication method | Hannes Eder, Ivan Nikitin, Jens Goerlich, Karsten Guth, Alexander Heinrich | 2014-01-28 |
| 8432024 | Integrated circuit including bond wire directly bonded to pad | Lothar Koenig | 2013-04-30 |
| 8415080 | Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer | Werner Kroeninger | 2013-04-09 |
| 8264072 | Electronic device | Holger Torwesten | 2012-09-11 |
| 8156643 | Semiconductor device | Markus Leicht, Stefan Woehlert, Edmund Riedl | 2012-04-17 |
| RE42980 | Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer | Werner Kroninger | 2011-11-29 |
| 8003292 | Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer | Werner Kroeninger | 2011-08-23 |
| 7918714 | Methods for treating wafers on assembly carriers | Werner Kroeninger | 2011-04-05 |
| 7911026 | Chip carrier with reduced interference signal sensitivity | Florian Binder, Thomas Haneder, Judith Lehmann, Grit Sommer | 2011-03-22 |
| 7911061 | Semiconductor device | Markus Leicht, Stefan Wohlert, Edmund Riedl | 2011-03-22 |
| 7868452 | Ultrathin semiconductor circuit having contact bumps | Dirk Mueller, Sokratis Sgouridis | 2011-01-11 |
| 7757390 | Method for production of a semiconductor component | Karsten Guth, Ivan Galesic | 2010-07-20 |
| 7755190 | Electronic device including a nickel-palladium alloy layer | Holger Torwesten | 2010-07-13 |
| 7674689 | Method of making an integrated circuit including singulating a semiconductor wafer | Werner Kroninger | 2010-03-09 |
| 7351514 | Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer | Werner Kroninger | 2008-04-01 |
| 7212019 | Probe needle for testing semiconductor chips and method for producing said probe needle | Frank Pietzschmann | 2007-05-01 |
| 6958256 | Process for the back-surface grinding of wafers | Michael Rogalli | 2005-10-25 |
| 6919269 | Production method for a semiconductor component | Wolfgang Jager, Ulrike Bewersdorff-Sarlette, Stephan Wege | 2005-07-19 |
| 6903009 | Methods for fabricating a contact for an integrated circuit | Alexander Ruf | 2005-06-07 |
| 6790737 | Method for fabricating thin metal layers from the liquid phase | Wolfgang Jaeger, Michael Rogalli | 2004-09-14 |
| 6752694 | Apparatus for and method of wafer grinding | Michael Roesner, David Wallis | 2004-06-22 |
| 6633379 | Apparatus and method for measuring the degradation of a tool | Michael Roesner, David Wallis | 2003-10-14 |
| 6268659 | Semiconductor body with layer of solder material comprising chromium | Holger Huebner | 2001-07-31 |
| 5993908 | Method of producing an aluminum film | Stefan Dietrich, Alexander Hirsch | 1999-11-30 |