Issued Patents All Time
Showing 51–51 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5901901 | Semiconductor assembly with solder material layer and method for soldering the semiconductor assemly | Holger Huebner | 1999-05-11 |
MS
Manfred Schneegans
Semiconductor 300 Gmbh & Co. Kg: 2 patents #1 of 25Top 4%
Siemens Aktiengesellschaft: 2 patents #6,658 of 22,248Top 30%
Infineon Technologies Austria Ag: 2 patents #458 of 1,126Top 45%
Qimonda Ag: 1 patents #252 of 575Top 45%
Technische Universität Wien: 1 patents #75 of 329Top 25%
Overall (All Time): #52,564 of 4,157,543Top 2%
51
Patents All Time