CL

Chenting Lin

Infineon Technologies Ag: 8 patents #1,105 of 7,486Top 15%
IBM: 6 patents #16,453 of 70,183Top 25%
SA Siemens Aktiengesellschaft: 2 patents #6,658 of 22,248Top 30%
NC Nova Crystals: 1 patents #3 of 11Top 30%
📍 Poughkeepsie, NY: #283 of 1,613 inventorsTop 20%
🗺 New York: #10,487 of 115,490 inventorsTop 10%
Overall (All Time): #355,084 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
7319270 Multi-layer electrode and method of forming the same Jingyu Lian, Nicolas Nagel, Michael Wise 2008-01-15
6943113 Metal chemical polishing process for minimizing dishing during semiconductor wafer fabrication Robert Ploessl 2005-09-13
6794705 Multi-layer Pt electrode for DRAM and FRAM with high K dielectric materials Jingyu Lian, Nicolas Nagel, Michael Wise 2004-09-21
6685796 CMP uniformity Robert J. van den Berg, Sumit Pandey 2004-02-03
6459709 Wavelength-tunable semiconductor laser diode Yu-Hwa Lo, Steven G. Hummel, Chau-Hong Kuo, Mei-Ling Shek-Stefan, Sergey V. Zaytsev 2002-10-01
6432725 Methods for crystallizing metallic oxide dielectric films at low temperature Jingyu Lian, Kwong Hon Wong, Katherine L. Saenger 2002-08-13
6429131 CMP uniformity Robert van den Berg, Sumit Pandey 2002-08-06
6420267 Method for forming an integrated barrier/plug for a stacked capacitor Ronald J. Schutz, Andreas Knorr, Keith Kwong Hon Wong, Hua Shen, Jenny Lian 2002-07-16
6413866 Method of forming a solute-enriched layer in a substrate surface and article formed thereby Horatio S. Wildman, Lawrence A. Clevenger, Kenneth P. Rodbell, Stefan Weber, Roy Iggulden +2 more 2002-07-02
6339007 Capacitor stack structure and method of fabricating description Yun-Yu Wang, Rajarao Jammy, Lee J. Kimball, David E. Kotecki, Jenny Lian +4 more 2002-01-15
6281114 Planarization after metal chemical mechanical polishing in semiconductor wafer fabrication Larry Clevenger, Ranier Florian Schnabel 2001-08-28
6222220 Extended trench for preventing interaction between components of stacked capacitors Andreas Knorr 2001-04-24
6132294 Method of enhancing semiconductor wafer release 2000-10-17
5972787 CMP process using indicator areas to determine endpoint Karl E. Boggs, Joachim Nuetzel, Robert Ploessl, Maria Ronay, Florian Schnabel +1 more 1999-10-26