Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400951 | Semiconductor device and method of manufacturing the same | — | 2025-08-26 |
| 12295137 | Method of manufacturing tsemiconductor device having bonding structure | Chiang-Lin Shih, Hsih-Yang Chiu | 2025-05-06 |
| 12293982 | Semiconductor structure having hybrid bonding pad | — | 2025-05-06 |
| 12278211 | Manufacturing method of semiconductor device | Hsih-Yang Chiu, Ching-Hung Chang, Chiang-Lin Shih | 2025-04-15 |
| 12266622 | Method of manufacturing semiconductor structure having hybrid bonding pad | — | 2025-04-01 |
| 11876077 | Semiconductor device and method of manufacturing the same | Hsih-Yang Chiu, Ching-Hung Chang, Chiang-Lin Shih | 2024-01-16 |
| 11842979 | Semiconductor device and method of manufacturing the same | Hsih-Yang Chiu, Ching-Hung Chang, Chiang-Lin Shih | 2023-12-12 |
| 11631656 | Method for manufacturing semiconductor structure | Hsih-Yang Chiu | 2023-04-18 |
| 11610878 | Semiconductor device with stacked chips and method for fabricating the same | — | 2023-03-21 |
| 11488840 | Wafer-to-wafer interconnection structure and method of manufacturing the same | — | 2022-11-01 |
| 11482474 | Forming a self-aligned TSV with narrow opening in horizontal isolation layer interfacing substrate | — | 2022-10-25 |
| 11342307 | Semiconductor structure and manufacturing method thereof | Hsih-Yang Chiu | 2022-05-24 |
| 11211351 | Apparatuses including redistribution layers and related microelectronic devices | Shih-Fan Kuan | 2021-12-28 |
| 10818508 | Semiconductor structure and method for preparing the same | — | 2020-10-27 |
| 10811382 | Method of manufacturing semiconductor device | Pei-Jhen Wu, Hsih-Yang Chiu, Chiang-Lin Shih, Ching-Hung Chang | 2020-10-20 |
| 10679958 | Methods of manufacturing a multi-device package | Shih-Fan Kuan | 2020-06-09 |
| 10593637 | Multi-device packages and related microelectronic devices | Shih-Fan Kuan | 2020-03-17 |
| 10373922 | Methods of manufacturing a multi-device package | Shih-Fan Kuan | 2019-08-06 |
| 9748106 | Method for fabricating semiconductor package | Neng-Tai Shih | 2017-08-29 |
| 9576933 | Fan-out wafer level packaging and manufacturing method thereof | — | 2017-02-21 |
| 9543270 | Multi-device package and manufacturing method thereof | Shih-Fan Kuan | 2017-01-10 |
| 8003528 | Semiconductor structure and method for making the same | Yu-Shan Chiu, Kuo-Hui Su, Chiang-Hung Lin | 2011-08-23 |
| 7341950 | Method for controlling a thickness of a first layer and method for adjusting the thickness of different first layers | Axel Buerke, Sven Schmidbauer, Chiang-Hung Lin | 2008-03-11 |