Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12295185 | Epitaxial substrate having a 2D material interposer, method for manufacturing the epitaxial substrate, and device prepared from the epitaxial substrate | Hsiao-Lei Wang, Kao-Mei Sung | 2025-05-06 |
| 11735540 | Apparatuses including dummy dice | Shing-Yih Shih | 2023-08-22 |
| 11062984 | Methods for forming semiconductor devices | Tzung-Han Lee, Yaw Wen Hu, Hsu Chiang, Hsin-Chuan Tsai, Sheng-Hsiung Wu | 2021-07-13 |
| 10937749 | Methods of forming microelectronic devices including dummy dice | Shing-Yih Shih | 2021-03-02 |
| 10818536 | Microelectronic devices including redistribution layers | Shing-Yih Shih, Hsu Chiang | 2020-10-27 |
| 10566229 | Microelectronic package structures including redistribution layers | Shing-Yih Shih, Hsu Chiang | 2020-02-18 |
| 10446509 | Methods of forming and operating microelectronic devices including dummy chips | Shing-Yih Shih | 2019-10-15 |
| 10121734 | Semiconductor device | Tzung-Han Lee, Yaw Wen Hu, Hsu Chiang, Hsin-Chuan Tsai, Sheng-Hsiung Wu | 2018-11-06 |
| 10043769 | Semiconductor devices including dummy chips | Shing-Yih Shih | 2018-08-07 |
| 9916999 | Methods of fabricating a semiconductor package structure including at least one redistribution layer | Shing-Yih Shih, Hsu Chiang | 2018-03-13 |
| 9748106 | Method for fabricating semiconductor package | Yi-Jen Lo | 2017-08-29 |
| 9520333 | Wafer level package and fabrication method thereof | Shing-Yih Shih, Hsu Chiang | 2016-12-13 |
| 9496358 | Semiconductor device and fabrication method therefor | Tzung-Han Lee, Yaw Wen Hu, Heng Hao Hsu, Yu Jing Chang, Hsu Chiang | 2016-11-15 |
| 9455243 | Silicon interposer and fabrication method thereof | Shih-Fan Kuan | 2016-09-27 |
| 9449953 | Package-on-package assembly and method for manufacturing the same | Shing-Yih Shih | 2016-09-20 |
| 9437583 | Package-on-package assembly and method for manufacturing the same | Shing-Yih Shih | 2016-09-06 |
| 9171847 | Semiconductor structure | Tzung-Han Lee, Yaw Wen Hu | 2015-10-27 |
| 8999733 | Method of forming RRAM structure | Chun-I Hsieh, Chang-Rong Wu | 2015-04-07 |
| 8901527 | Resistive random access memory structure with tri-layer resistive stack | Chun-I Hsieh, Chang-Rong Wu | 2014-12-02 |
| 8487290 | RRAM with improved resistance transformation characteristic and method of making the same | Chun-I Hsieh, Chang-Rong Wu, Kou-Chen Liu | 2013-07-16 |
| 8455984 | Integrated circuit structure and method of forming the same | KEE-WEI CHUNG, Chiang-Hung Lin | 2013-06-04 |
| 8395209 | Single-sided access device and fabrication method thereof | Hsin-Jung Ho, Jeng-Ping Lin, Chang-Rong Wu, Chiang-Hung Lin, CHIH-HUANG WU | 2013-03-12 |
| 7993985 | Method for forming a semiconductor device with a single-sided buried strap | Ming-Cheng Chang | 2011-08-09 |
| 7985998 | Trench-type semiconductor device structure | Shian-Jyh Lin, Ming-Cheng Chang, Hung-Chang Liao | 2011-07-26 |
| 7759190 | Memory device and fabrication method thereof | Jeng-Ping Lin | 2010-07-20 |