Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12295185 | Epitaxial substrate having a 2D material interposer, method for manufacturing the epitaxial substrate, and device prepared from the epitaxial substrate | Hsiao-Lei Wang, Neng-Tai Shih | 2025-05-06 |
| 10297446 | Encapsulated substrate, manufacturing method, high band-gap device having encapsulated substrate | Hsiao-Lei Wang, Po-Yen Liu | 2019-05-21 |