Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9972554 | Wafer level chip scale package having continuous through hole via configuration and fabrication method thereof | Li-Chih Fang, Chia-Chang Chang, Hung-Hsin Hsu, Wen-Hsiung Chang, Chia-Wen Lien | 2018-05-15 |
| 8455984 | Integrated circuit structure and method of forming the same | Chiang-Hung Lin, Neng-Tai Shih | 2013-06-04 |