Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157784 | Integration of a self-forming barrier layer and a ruthenium metal liner in copper metallization | Kai-Hung Yu, Manabu Oie, Kaoru Maekawa, Cory Wajda, Gerrit J. Leusink +2 more | 2018-12-18 |
| 7976956 | Laminated circuit board | Yuuji Suzuki, Satoru Zama | 2011-07-12 |
| 7794578 | Method for preparing a circuit board material having a conductive base and a resistance layer | Akira Matsuda, Yuuji Suzuki, Hideo Otsuka, Sadao Matsumoto | 2010-09-14 |
| 7215235 | Conductive substrate with resistance layer, resistance board, and resistance circuit board | Akira Matsuda, Yuuji Suzuki, Hideo Otsuka, Sadao Matsumoto | 2007-05-08 |