HO

Hideo Otsuka

FF Furukawa Circuit Foil.: 2 patents #4 of 18Top 25%
SC Stanley Electric Co.: 2 patents #339 of 1,072Top 35%
CC Circuit Foil Japan Co.: 1 patents #10 of 18Top 60%
FC Furukawa Electric Co.: 1 patents #1,242 of 2,370Top 55%
TO Toshiba: 1 patents #1,121 of 2,688Top 45%
TC Toyo Seikan Co.: 1 patents #498 of 888Top 60%
Overall (All Time): #620,888 of 4,157,543Top 15%
8
Patents All Time

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #TitleCo-InventorsDate
11686450 Vehicle lamp Takaaki Hasegawa, Teruo Koike, Yoshitaka Narumi 2023-06-27
9080742 Near infrared illuminator 2015-07-14
7794578 Method for preparing a circuit board material having a conductive base and a resistance layer Akira Matsuda, Yuuji Suzuki, Yuuki Kikuchi, Sadao Matsumoto 2010-09-14
7215235 Conductive substrate with resistance layer, resistance board, and resistance circuit board Akira Matsuda, Yuuji Suzuki, Yuuki Kikuchi, Sadao Matsumoto 2007-05-08
7172818 Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board Tadao Nakaoka, Akitoshi Suzuki, Hisao Kimijima 2007-02-06
5834140 Electrodeposited copper foil for fine pattern and method for producing the same Adam M. Wolski, Michel Streel, Akitoshi Suzuki 1998-11-10
5829623 Easily openable can lid Hiroyuki Terasawa, Shigeaki Yamanashi, Ichio Otsuka, Sunao Morishita 1998-11-03
4401506 Process for producing semiconductor device 1983-08-30