Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11254001 | Controller, control system and ladder program | — | 2022-02-22 |
| 10518938 | Container | Masatoshi Aihara, Hiroki Yokoyama | 2019-12-31 |
| 10160119 | Robot system | — | 2018-12-25 |
| 9102117 | Sheet processing apparatus, image forming system, and sheet folding method | Tomohiro Furuhashi, Shuuya Nagasako, Akira Kunieda, Michitaka Suzuki, Kyosuke Nakada +3 more | 2015-08-11 |
| 9078341 | Display device | — | 2015-07-07 |
| 9016679 | Sheet processing apparatus and image forming system | Akira Kunieda, Tomohiro Furuhashi, Shuuya Nagasako, Michitaka Suzuki, Kazuya Yamamoto +3 more | 2015-04-28 |
| 8153273 | Surface treated electrodeposited copper foil and circuit board | Takahiro Saito, Sadao Matsumoto | 2012-04-10 |
| 7985485 | Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil | Takami Moteki, Kazuhiro Hoshino, Kensaku Shinozaki, Akira Matsuda | 2011-07-26 |
| 7985488 | Ultrathin copper foil with carrier and printed circuit board using same | Takami Moteki, Kazuhiro Hoshino, Satoshi Fujisawa, Akira Kawakami | 2011-07-26 |
| 7976956 | Laminated circuit board | Yuuki Kikuchi, Satoru Zama | 2011-07-12 |
| 7892655 | Ultrathin copper foil with carrier and printed circuit board using same | Takami Moteki, Kazuhiro Hoshino, Satoshi Fujisawa, Akira Kawakami | 2011-02-22 |
| 7794578 | Method for preparing a circuit board material having a conductive base and a resistance layer | Akira Matsuda, Hideo Otsuka, Yuuki Kikuchi, Sadao Matsumoto | 2010-09-14 |
| 7771841 | Ultrathin copper foil with carrier and printed circuit board using same | Takami Moteki, Kazuhiro Hoshino, Satoshi Fujisawa, Akira Kawakami | 2010-08-10 |
| 7381475 | Treated copper foil and circuit board | — | 2008-06-03 |
| 7275795 | Braking system of hybrid vehicle | Mitsuhiro Nishina, Tatsuji Miyata | 2007-10-02 |
| 7223481 | Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board | Akira Matsuda | 2007-05-29 |
| 7215235 | Conductive substrate with resistance layer, resistance board, and resistance circuit board | Akira Matsuda, Hideo Otsuka, Yuuki Kikuchi, Sadao Matsumoto | 2007-05-08 |
| 7078928 | Semiconductor integrated circuit device | Ryusuke Sahara, Kozaburo Kurita, Mitsugu Kusunoki, Hideki Sakakibara | 2006-07-18 |
| 6944280 | Gateway system having a redundant structure of media gateway controllers | — | 2005-09-13 |
| 6939400 | Ink, production method of the same materials for producing the same and printed matter with the same | — | 2005-09-06 |
| 6924043 | Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier | Akira Matsuda | 2005-08-02 |
| 6312400 | Air expandable bodies reciprocating a massage element | Hiromitu Itikawa, Syouji Hosino | 2001-11-06 |
| 5614328 | Reflow-plated member and a manufacturing method therefor | Satoshi Suzuki, Kazuya Takahashi, Teruo KAWADA, Morimasa Tanimoto | 1997-03-25 |
| 4725860 | Ink carrier film in use with ink jet recording device | Mitsuaki Kohyama, Yasuo Hosaka, Tadayoshi Ohno | 1988-02-16 |