Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6372113 | Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same | Charles B. Yates, George Gaskill, Chinsai T. Cheng, Ajesh Shah, Paul E. DuFresne | 2002-04-16 |
| 6270645 | Simplified process for production of roughened copper foil | Charles B. Yates, George Gaskill, Chinsai T. Cheng, Keith Bodendorf, Paul E. DuFresne | 2001-08-07 |
| 6270648 | Process and apparatus for the manufacture of high peel-strength copper foil useful in the manufacture of printed circuit boards, and laminates made with such foil | Charles B. Yates, George Gaskill, Ajesh Shah, Chinsai T. Cheng, Keith Bodendorf | 2001-08-07 |
| 6224991 | Process for electrodeposition of barrier layer over copper foil bonding treatment, products thereof and electrolyte useful in such process | Charles B. Yates, George Gaskill, Chinsai T. Cheng, Ajesh Shah, Paul E. DuFresne | 2001-05-01 |
| 5989727 | Electrolytic copper foil having a modified shiny side | Charles B. Yates, George Gaskill, Chinsai T. Cheng, Keith Bodendorf, Paul E. DuFresne | 1999-11-23 |
| 5863410 | Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby | Charles B. Yates, Chintsai T. Cheng | 1999-01-26 |
| 5834140 | Electrodeposited copper foil for fine pattern and method for producing the same | Michel Streel, Akitoshi Suzuki, Hideo Otsuka | 1998-11-10 |
| 5447619 | Copper foil for the manufacture of printed circuit boards and method of producing the same | Paul E. DuFresne, Kurt Ac, Michel Mathieu | 1995-09-05 |
| 5215646 | Low profile copper foil and process and apparatus for making bondable metal foils | Kurt Acx, Michel Mathieu, Laure M. Maquet | 1993-06-01 |
| 5207889 | Method of producing treated copper foil, products thereof and electrolyte useful in such method | Laurette M. Maguet, Michel Streel | 1993-05-04 |
| 4915797 | Continuous process for coating printed circuit grade copper foil with a protective resin | Lawrence E. Vigezzi | 1990-04-10 |
| 4572768 | Treatment for copper foil | Chintsai T. Cheng, Richard B. Simon, Manoj C. Gambhirwala | 1986-02-25 |