Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6372113 | Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same | Charles B. Yates, George Gaskill, Ajesh Shah, Adam M. Wolski, Paul E. DuFresne | 2002-04-16 |
| 6342308 | Copper foil bonding treatment with improved bond strength and resistance to undercutting | Charles B. Yates, George Gaskill, Ajesh Shah | 2002-01-29 |
| 6270645 | Simplified process for production of roughened copper foil | Charles B. Yates, Adam M. Wolski, George Gaskill, Keith Bodendorf, Paul E. DuFresne | 2001-08-07 |
| 6270648 | Process and apparatus for the manufacture of high peel-strength copper foil useful in the manufacture of printed circuit boards, and laminates made with such foil | Charles B. Yates, George Gaskill, Ajesh Shah, Keith Bodendorf, Adam M. Wolski | 2001-08-07 |
| 6224991 | Process for electrodeposition of barrier layer over copper foil bonding treatment, products thereof and electrolyte useful in such process | Charles B. Yates, George Gaskill, Ajesh Shah, Adam M. Wolski, Paul E. DuFresne | 2001-05-01 |
| 5989727 | Electrolytic copper foil having a modified shiny side | Charles B. Yates, Adam M. Wolski, George Gaskill, Keith Bodendorf, Paul E. DuFresne | 1999-11-23 |