Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300467 | Plasma processing method and plasma processing apparatus | Takanori BANSE, Toru Hisamatsu | 2025-05-13 |
| 11899476 | Method and apparatus for measuring gas flow | Risako Matsuda, Shinichiro Hayasaka, Keita Shouji | 2024-02-13 |
| 11742228 | Substrate processing method and substrate processing system | Risako Matsuda, Shinobu KINOSHITA, Keita Shouji | 2023-08-29 |
| 10157784 | Integration of a self-forming barrier layer and a ruthenium metal liner in copper metallization | Kai-Hung Yu, Kaoru Maekawa, Cory Wajda, Gerrit J. Leusink, Yuuki Kikuchi +2 more | 2018-12-18 |
| 9607888 | Integration of ALD barrier layer and CVD Ru liner for void-free Cu filling | Kai-Hung Yu, Toshio Hasegawa, Tadahiro Ishizaka, Fumitaka Amano, Steven P. Consiglio +3 more | 2017-03-28 |