Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11700778 | Method for controlling the forming voltage in resistive random access memory devices | Cory Wajda, Kandabara Tapily, Takaaki Tsunomura, Takashi Ando, Paul C. Jamison +3 more | 2023-07-11 |
| 10991881 | Method for controlling the forming voltage in resistive random access memory devices | Cory Wajda, Kandabara Tapily, Takaaki Tsunomura, Takashi Ando, Paul C. Jamison +3 more | 2021-04-27 |
| 9978649 | Solid source doping for source and drain extension doping | Robert D. Clark, Jeffrey Smith | 2018-05-22 |
| 9899224 | Method of controlling solid phase diffusion of boron dopants to form ultra-shallow doping regions | Robert D. Clark, David L. O'Meara | 2018-02-20 |
| 9607888 | Integration of ALD barrier layer and CVD Ru liner for void-free Cu filling | Kai-Hung Yu, Toshio Hasegawa, Tadahiro Ishizaka, Manabu Oie, Fumitaka Amano +3 more | 2017-03-28 |
| 9064694 | Nitridation of atomic layer deposited high-k dielectrics using trisilylamine | Robert D. Clark, Christian Dussarrat, Vincent M. Omarjee, Venkat Pallem, Glenn Kuchenbeiser | 2015-06-23 |
| 8722548 | Structures and techniques for atomic layer deposition | Shintaro Aoyama, Robert D. Clark, Marinus Hopstaken, Hemanth Jagannathan, Paul C. Jamison +4 more | 2014-05-13 |