Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381118 | 3D multiple location compressing bonded arm for advanced integration | Andrew WELOTH, Anthony R. Schepis, Mark I. Gardner, H. Jim Fulford, Anton J. deVilliers +1 more | 2025-08-05 |
| 12341053 | System for backside deposition of a substrate | Ronald Nasman, Gerrit J. Leusink, Rodney L. Robison, Hoyoung Kang | 2025-06-24 |
| 12276922 | Backside deposition tuning of stress to control wafer bow in semiconductor processing | Anton J. deVilliers | 2025-04-15 |
| 12204253 | In-situ lithography pattern enhancement with localized stress treatment tuning using heat zones | Andrew WELOTH, Michael Murphy, Steven Gueci, David Conklin | 2025-01-21 |
| 12001147 | Precision multi-axis photolithography alignment correction using stressor film | Anthony R. Schepis, Mark I. Gardner, Anton J. deVilliers, H. Jim Fulford | 2024-06-04 |
| 11994807 | In-situ lithography pattern enhancement with localized stress treatment tuning using heat zones | Andrew WELOTH, Michael Murphy, Steven Gueci, David Conklin | 2024-05-28 |
| 11990334 | Method for tuning stress transitions of films on a substrate | Jodi Grzeskowiak, Anton J. deVilliers | 2024-05-21 |
| 11908728 | System for backside deposition of a substrate | Ronald Nasman, Gerrit J. Leusink, Rodney L. Robison, Hoyoung Kang | 2024-02-20 |
| 11883837 | System and method for liquid dispense and coverage control | Mirko Vukovic, Anton J. deVilliers | 2024-01-30 |
| 11854806 | Method for pattern reduction using a staircase spacer | Anton J. deVilliers | 2023-12-26 |
| 11841617 | Method of forming a narrow trench | Anton J. deVilliers, Jodi Grzeskowiak, Richard A. Farrell, Jeffrey Smith | 2023-12-12 |
| 11776812 | Method for pattern reduction using a staircase spacer | Anton J. deVilliers | 2023-10-03 |
| 11721551 | Localized stress regions for three-dimension chiplet formation | Anton J. deVilliers, Anthony R. Schepis, Mark I. Gardner, H. Jim Fulford | 2023-08-08 |
| 11688642 | Localized stress regions for three-dimension chiplet formation | Anton J. deVilliers, Anthony R. Schepis, Mark I. Gardner, H. Jim Fulford | 2023-06-27 |
| 11656550 | Controlling semiconductor film thickness | Michael Murphy, Jodi Grzeskowiak, Jeffrey Smith | 2023-05-23 |
| 11393694 | Method for planarization of organic films | Anton J. deVilliers, Robert Brandt, Jeffrey Smith, Jodi Grzeskowiak | 2022-07-19 |
| 11335566 | Method for planarization of spin-on and CVD-deposited organic films | Jodi Grzeskowiak, Anton J. deVilliers | 2022-05-17 |
| 11201051 | Method for layer by layer growth of conformal films | Jodi Grzeskowiak, Anton J. deVilliers | 2021-12-14 |
| 10923363 | Method for increasing pattern density on a wafer | Sanjana Das, Anton J. deVilliers | 2021-02-16 |
| 10453692 | Location-specific tuning of stress to control bow to control overlay in semiconductor processing | Anton J. deVilliers | 2019-10-22 |
| 10431468 | Location-specific tuning of stress to control bow to control overlay in semiconductor processing | Anton J. deVilliers | 2019-10-01 |
| 9977339 | System and method for shifting critical dimensions of patterned films | Anton J. deVilliers | 2018-05-22 |
| 9735067 | Substrate tuning system and method using optical projection | Anton J. deVilliers, Gerrit J. Leusink | 2017-08-15 |
| 9646898 | Methods for treating a substrate by optical projection of a correction pattern based on a detected spatial heat signature of the substrate | Anton J. deVilliers, Gerrit J. Leusink | 2017-05-09 |