| 12411412 |
Patterning semiconductor features |
Michael Murphy, Charlotte Cutler |
2025-09-09 |
| 12381093 |
Hybrid patterning-bonding semiconductor tool |
Anthony R. Schepis, Andrew WELOTH, Anton J. deVilliers |
2025-08-05 |
| 12381118 |
3D multiple location compressing bonded arm for advanced integration |
Andrew WELOTH, Daniel Fulford, Anthony R. Schepis, Mark I. Gardner, H. Jim Fulford +1 more |
2025-08-05 |
| 12374562 |
Wafer shape control for W2W bonding |
Anthony R. Schepis, Andrew WELOTH, Anton J. deVilliers |
2025-07-29 |
| 12204253 |
In-situ lithography pattern enhancement with localized stress treatment tuning using heat zones |
Andrew WELOTH, Michael Murphy, Daniel Fulford, Steven Gueci |
2025-01-21 |
| 11994807 |
In-situ lithography pattern enhancement with localized stress treatment tuning using heat zones |
Andrew WELOTH, Michael Murphy, Daniel Fulford, Steven Gueci |
2024-05-28 |
| 11526088 |
Coaxial see-through alignment imaging system |
Anton J. deVilliers, Anthony R. Schepis |
2022-12-13 |
| 7077311 |
Document transport control system |
Bret Stubbs |
2006-07-18 |