Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12284820 | Dual metal wrap-around contacts for semiconductor devices | Hiroaki Niimi, Kandabara Tapily | 2025-04-22 |
| 11621190 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, David L. O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Robert D. Clark +3 more | 2023-04-04 |
| 11374101 | Dual metal wrap-around contacts for semiconductor devices | Hiroaki Niimi, Kandabara Tapily | 2022-06-28 |
| 11024535 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, David L. O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Robert D. Clark +3 more | 2021-06-01 |
| 10378105 | Selective deposition with surface treatment | Kai-Hung Yu, Kandabara Tapily, Subhadeep Kal, Gerrit J. Leusink | 2019-08-13 |
| 10361366 | Resistive random accress memory containing a conformal titanium aluminum carbide film and method of making | Genji Nakamura, Sara Aoki, Toshio Hasegawa, Takamichi Kikuchi | 2019-07-23 |
| 10056328 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Gerrit J. Leusink, Cory Wajda, Tadahiro Ishizaka | 2018-08-21 |
| 9711449 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Gerrit J. Leusink, Cory Wajda, Tadahiro Ishizaka | 2017-07-18 |