Issued Patents All Time
Showing 25 most recent of 126 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400963 | Conductive superlattice structures and methods of forming the same | Gerrit J. Leusink, Hiroki Maehara, Einstein Noel Abarra, Naoki Watanabe | 2025-08-26 |
| 12288692 | Method of forming a FET structure by selective deposition of film on source/drain contact | Yun Han, Alok Ranjan, Peter Ventzek, Andrew Metz | 2025-04-29 |
| 12284820 | Dual metal wrap-around contacts for semiconductor devices | Kandabara Tapily, Takahiro Hakamata | 2025-04-22 |
| 12237216 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, Shihsheng Chang, Ying Trickett, Eric Chih-Fang Liu, Yun Han +5 more | 2025-02-25 |
| 11562906 | Low resistance source drain contact formation with trench metastable alloys and laser annealing | Oleg Gluschenkov, Zuoguang Liu, Shogo Mochizuki, Tenko Yamashita, Chun-Chen Yeh | 2023-01-24 |
| 11374101 | Dual metal wrap-around contacts for semiconductor devices | Kandabara Tapily, Takahiro Hakamata | 2022-06-28 |
| 11264274 | Reverse contact and silicide process for three-dimensional logic devices | Jeffrey Smith, Jodi Grzeskowiak, Daniel Chanemougame, Lars Liebmann, Kandabara Tapily +2 more | 2022-03-01 |
| 11201089 | Robust low-k bottom spacer for VFET | Pietro Montanini, Kangguo Cheng | 2021-12-14 |
| 11171060 | Dual metal contacts with ruthenium metal plugs for semiconductor devices | Gyanaranjan Pattanaik | 2021-11-09 |
| 10978353 | High mobility transistors | Manoj Mehrotra, Charles Frank Machala, III, Rick L. Wise | 2021-04-13 |
| 10943992 | Transistor having straight bottom spacers | Kangguo Cheng, Christopher J. Waskiewicz, Michael P. Belyansky, Brent A. Anderson, Muthumanickam Sankarapandian +1 more | 2021-03-09 |
| 10879133 | Replacement metal gate process for CMOS integrated circuits | Seung-Chul Song | 2020-12-29 |
| 10854510 | Titanium silicide formation in a narrow source-drain contact | Min Gyu Sung, Kwanyong LIM | 2020-12-01 |
| 10833019 | Dual metal-insulator-semiconductor contact structure and formulation method | Takashi Ando, Tenko Yamashita | 2020-11-10 |
| 10818599 | Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contacts | Shariq Siddiqui, Tenko Yamashita | 2020-10-27 |
| 10804270 | Contact formation through low-tempearature epitaxial deposition in semiconductor devices | Oleg Gluschenkov, Shogo Mochizuki, Tenko Yamashita, Chun-Chen Yeh | 2020-10-13 |
| 10692868 | Contact formation through low-temperature epitaxial deposition in semiconductor devices | Oleg Gluschenkov, Shogo Mochizuki, Tenko Yamashita, Chun-Chen Yeh | 2020-06-23 |
| 10685961 | Contact formation in semiconductor devices | Oleg Gluschenkov, Zuoguang Liu, Joseph S. Washington, Tenko Yamashita | 2020-06-16 |
| 10643894 | Surface area and Schottky barrier height engineering for contact trench epitaxy | Jody A. Fronheiser, Shogo Mochizuki, Balasubramanian Pranatharthiharan, Mark V. Raymond, Tenko Yamashita | 2020-05-05 |
| 10643893 | Surface area and Schottky barrier height engineering for contact trench epitaxy | Jody A. Fronheiser, Shogo Mochizuki, Balasubramanian Pranatharthiharan, Mark V. Raymond, Tenko Yamashita | 2020-05-05 |
| 10586769 | Contact formation in semiconductor devices | Oleg Gluschenkov, Jiseok Kim, Zuoguang Liu, Shogo Mochizuki | 2020-03-10 |
| 10535606 | Dual metal-insulator-semiconductor contact structure and formulation method | Takashi Ando, Tenko Yamashita | 2020-01-14 |
| 10510617 | CMOS VFET contacts with trench solid and liquid phase epitaxy | Oleg Gluschenkov, Zuoguang Liu, Shogo Mochizuki, Tenko Yamashita | 2019-12-17 |
| 10475904 | Methods of forming merged source/drain regions on integrated circuit products | Steven Bentley, Romain Lallement, Brent A. Anderson, Junli Wang, Muthumanickam Sankarapandian | 2019-11-12 |
| 10439040 | Methods to enhance effective work function of mid-gap metal by incorporating oxygen and hydrogen at a low thermal budget | James Joseph Chambers | 2019-10-08 |