SC

Steven P. Caliendo

TE Tel Epion: 7 patents #9 of 54Top 20%
TL Tokyo Electron Limited: 5 patents #1,450 of 5,567Top 30%
📍 Ashby, MA: #2 of 29 inventorsTop 7%
🗺 Massachusetts: #10,511 of 88,656 inventorsTop 15%
Overall (All Time): #415,476 of 4,157,543Top 10%
12
Patents All Time

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
10256095 Method for high throughput using beam scan size and beam position in gas cluster ion beam processing system Soo Doo Chae, Noel Russell, Joshua LaRose, Nicholas Joy, Luis Fernandez +3 more 2019-04-09
9502209 Multi-step location specific process for substrate edge profile correction for GCIB system Hongyu Yue, Noel Russell, Vincent Gizzo, Joshua LaRose 2016-11-22
9105443 Multi-step location specific process for substrate edge profile correction for GCIB system Hongyu Yue, Noel Russell, Vincent Gizzo, Joshua LaRose 2015-08-11
8298432 Method and system for adjusting beam dimension for high-gradient location specific processing Ruairidh MacCrimmon, Nicolaus J. Hofmeester 2012-10-30
8293126 Method and system for multi-pass correction of substrate defects Ruairidh MacCrimmon, Nicolaus J. Hofmeester 2012-10-23
7917241 Method and system for increasing throughput during location specific processing of a plurality of substrates Nicolaus J. Hofmeester 2011-03-29
7564024 Methods and apparatus for assigning a beam intensity profile to a gas cluster ion beam used to process workpieces Nicolaus J. Hofmeester, Thomas G. Tetreault, Ruairidh MacCrimmon 2009-07-21
7521089 Method and apparatus for controlling the movement of CVD reaction byproduct gases to adjacent process chambers Joseph T. Hillman, John G. North, John Hautala 2009-04-21
6626186 Method for stabilizing the internal surface of a PECVD process chamber Joseph T. Hillman, Gerrit J. Leusink 2003-09-30
6562708 Method for incorporating silicon into CVD metal films Joseph T. Hillman 2003-05-13
6482477 Method for pretreating dielectric layers to enhance the adhesion of CVD metal layers thereto Richard Westhoff, Joseph T. Hillman 2002-11-19
6455414 Method for improving the adhesion of sputtered copper films to CVD transition metal based underlayers Joseph T. Hillman, Cory Wajda 2002-09-24