Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7772121 | Method of forming a trench structure | Liang-Yuh Chen, Israel Beinglass | 2010-08-10 |
| 7427568 | Method of forming an interconnect structure | Liang-Yuh Chen, Israel Beinglass | 2008-09-23 |
| 7375023 | Method and apparatus for chemical mechanical polishing of semiconductor substrates | Stan Tsai, Liang-Yuh Chen, Lizhong Sun, Shijian Li, Feng Q. Liu +2 more | 2008-05-20 |
| 7344432 | Conductive pad with ion exchange membrane for electrochemical mechanical polishing | Liang-Yun Chen, Yuchun Wang, Yan Wang, Alain Duboust, Ralph Wadensweiler +9 more | 2008-03-18 |
| 7323095 | Integrated multi-step gap fill and all feature planarization for conductive materials | Wei-Yung Hsu, Liang-Yuh Chen, Ratson Morad, Sasson Somekh | 2008-01-29 |
| 7311592 | Conductive polishing article for electrochemical mechanical polishing | Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Ralph Wadensweiler +4 more | 2007-12-25 |
| 7137879 | Conductive polishing article for electrochemical mechanical polishing | Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Ralph Wadensweiler +4 more | 2006-11-21 |
| 7115516 | Method of depositing a material layer | Liang-Yuh Chen, Israel Beinglass | 2006-10-03 |
| 7066800 | Conductive polishing article for electrochemical mechanical polishing | Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Ralph Wadensweiler +4 more | 2006-06-27 |
| 7060606 | Method and apparatus for chemical mechanical polishing of semiconductor substrates | Stan Tsai, Liang-Yuh Chen, Lizhong Sun, Shijian Li, Feng Q. Liu +2 more | 2006-06-13 |
| 6988942 | Conductive polishing article for electrochemical mechanical polishing | Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Ralph Wadensweiler +4 more | 2006-01-24 |
| 6896776 | Method and apparatus for electro-chemical processing | Wei-Yung Hsu, Liang-Yuh Chen, Ratson Morad, Sasson Somekh | 2005-05-24 |
| 6893548 | Method of conditioning electrochemical baths in plating technology | Robin Cheung, Liang-Yuh Chen, Yezdi Dordi, Paul Smith, Ratson Morad +2 more | 2005-05-17 |
| 6884724 | Method for dishing reduction and feature passivation in polishing processes | Wei-Yung Hsu, Liang-Yuh Chen, Ratson Morad | 2005-04-26 |
| 6821881 | Method for chemical mechanical polishing of semiconductor substrates | Stan Tsai, Liang-Yuh Chen, Lizhong Sun, Shijian Li, Feng Q. Liu +2 more | 2004-11-23 |
| 6811680 | Planarization of substrates using electrochemical mechanical polishing | Liang-Yuh Chen, Wei-Yung Hsu, Alain Duboust, Ratson Morad | 2004-11-02 |
| 6773507 | Apparatus and method for fast-cycle atomic layer deposition | Ravi Jallepally, Shih-Hung Li, Alain Duboust, Jun Zhao, Liang-Yuh Chen | 2004-08-10 |
| 6677239 | Methods and compositions for chemical mechanical polishing | Wei-Yung Hsu, Gopalakrishna B. Prabhu, Lizhong Sun | 2004-01-13 |
| 6436267 | Method for achieving copper fill of high aspect ratio interconnect features | Barry Chin, Liang-Yuh Chen, Robin Cheung, Peijun Ding, Yezdi Dordi +3 more | 2002-08-20 |
| 6372633 | Method and apparatus for forming metal interconnects | Dan Maydan, Ashok Sinha, Zheng Xu, Liang Chen, Roderick C. Mosely +3 more | 2002-04-16 |
| 6362099 | Method for enhancing the adhesion of copper deposited by chemical vapor deposition | Srinivas Gandikota, Dennis Cong, Liang-Yuh Chen, Sesh Ramaswami | 2002-03-26 |
| 6258223 | In-situ electroless copper seed layer enhancement in an electroplating system | Robin Cheung, Yezdi Dordi, Peter Hey, Ratson Morad, Liang-Yuh Chen +2 more | 2001-07-10 |
| 5766968 | Micro mask comprising agglomerated material | Michael D. Armacost, A. Richard Baker, Jr., Wayne S. Berry, Donald McAllpine Kenney, Thomas J. Licata | 1998-06-16 |
| 5672537 | Method for preparing a narrow angle defined trench in a substrate | Donald M. Kenney, Walter E. Mlynko, Son Van Nguyen | 1997-09-30 |
| 5610441 | Angle defined trench conductor for a semiconductor device | Donald M. Kenney, Walter E. Mlynko, Son V. Nguyen | 1997-03-11 |