| 7772121 |
Method of forming a trench structure |
Liang-Yuh Chen, Israel Beinglass |
2010-08-10 |
$7,625,000 |
| 7427568 |
Method of forming an interconnect structure |
Liang-Yuh Chen, Israel Beinglass |
2008-09-23 |
$41,807,000 |
| 7375023 |
Method and apparatus for chemical mechanical polishing of semiconductor substrates |
Stan Tsai, Liang-Yuh Chen, Lizhong Sun, Shijian Li, Feng Q. Liu +2 more |
2008-05-20 |
$13,768,000 |
| 7344432 |
Conductive pad with ion exchange membrane for electrochemical mechanical polishing |
Liang-Yun Chen, Yuchun Wang, Yan Wang, Alain Duboust, Ralph Wadensweiler +9 more |
2008-03-18 |
$36,315,000 |
| 7323095 |
Integrated multi-step gap fill and all feature planarization for conductive materials |
Wei-Yung Hsu, Liang-Yuh Chen, Ratson Morad, Sasson Somekh |
2008-01-29 |
$14,525,000 |
| 7311592 |
Conductive polishing article for electrochemical mechanical polishing |
Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Ralph Wadensweiler +4 more |
2007-12-25 |
|
| 7137879 |
Conductive polishing article for electrochemical mechanical polishing |
Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Ralph Wadensweiler +4 more |
2006-11-21 |
$24,429,000 |
| 7115516 |
Method of depositing a material layer |
Liang-Yuh Chen, Israel Beinglass |
2006-10-03 |
$12,847,000 |
| 7066800 |
Conductive polishing article for electrochemical mechanical polishing |
Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Ralph Wadensweiler +4 more |
2006-06-27 |
$13,196,000 |
| 7060606 |
Method and apparatus for chemical mechanical polishing of semiconductor substrates |
Stan Tsai, Liang-Yuh Chen, Lizhong Sun, Shijian Li, Feng Q. Liu +2 more |
2006-06-13 |
$25,107,000 |
| 6988942 |
Conductive polishing article for electrochemical mechanical polishing |
Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Ralph Wadensweiler +4 more |
2006-01-24 |
$87,939,000 |
| 6896776 |
Method and apparatus for electro-chemical processing |
Wei-Yung Hsu, Liang-Yuh Chen, Ratson Morad, Sasson Somekh |
2005-05-24 |
$9,995,000 |
| 6893548 |
Method of conditioning electrochemical baths in plating technology |
Robin Cheung, Liang-Yuh Chen, Yezdi Dordi, Paul Smith, Ratson Morad +2 more |
2005-05-17 |
$19,109,000 |
| 6884724 |
Method for dishing reduction and feature passivation in polishing processes |
Wei-Yung Hsu, Liang-Yuh Chen, Ratson Morad |
2005-04-26 |
$27,390,000 |
| 6821881 |
Method for chemical mechanical polishing of semiconductor substrates |
Stan Tsai, Liang-Yuh Chen, Lizhong Sun, Shijian Li, Feng Q. Liu +2 more |
2004-11-23 |
$17,815,000 |
| 6811680 |
Planarization of substrates using electrochemical mechanical polishing |
Liang-Yuh Chen, Wei-Yung Hsu, Alain Duboust, Ratson Morad |
2004-11-02 |
$17,088,000 |
| 6773507 |
Apparatus and method for fast-cycle atomic layer deposition |
Ravi Jallepally, Shih-Hung Li, Alain Duboust, Jun Zhao, Liang-Yuh Chen |
2004-08-10 |
$32,377,000 |
| 6677239 |
Methods and compositions for chemical mechanical polishing |
Wei-Yung Hsu, Gopalakrishna B. Prabhu, Lizhong Sun |
2004-01-13 |
$26,561,000 |
| 6436267 |
Method for achieving copper fill of high aspect ratio interconnect features |
Barry Chin, Liang-Yuh Chen, Robin Cheung, Peijun Ding, Yezdi Dordi +3 more |
2002-08-20 |
$16,370,000 |
| 6372633 |
Method and apparatus for forming metal interconnects |
Dan Maydan, Ashok Sinha, Zheng Xu, Liang Chen, Roderick C. Mosely +3 more |
2002-04-16 |
$57,634,000 |
| 6362099 |
Method for enhancing the adhesion of copper deposited by chemical vapor deposition |
Srinivas Gandikota, Dennis Cong, Liang-Yuh Chen, Sesh Ramaswami |
2002-03-26 |
$33,068,000 |
| 6258223 |
In-situ electroless copper seed layer enhancement in an electroplating system |
Robin Cheung, Yezdi Dordi, Peter Hey, Ratson Morad, Liang-Yuh Chen +2 more |
2001-07-10 |
$71,204,000 |
| 5766968 |
Micro mask comprising agglomerated material |
Michael D. Armacost, A. Richard Baker, Jr., Wayne S. Berry, Donald McAllpine Kenney, Thomas J. Licata |
1998-06-16 |
$7,430,000 |
| 5672537 |
Method for preparing a narrow angle defined trench in a substrate |
Donald M. Kenney, Walter E. Mlynko, Son Van Nguyen |
1997-09-30 |
$18,961,000 |
| 5610441 |
Angle defined trench conductor for a semiconductor device |
Donald M. Kenney, Walter E. Mlynko, Son V. Nguyen |
1997-03-11 |
$14,179,000 |
