Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7497932 | Electro-chemical deposition system | Mark Cassidy Cridlin Lloyd, Donald Olgado, Ratson Morad, Mark Denome, Michael Sugarman +10 more | 2009-03-03 |
| 6893548 | Method of conditioning electrochemical baths in plating technology | Robin Cheung, Daniel Carl, Liang-Yuh Chen, Yezdi Dordi, Paul Smith +2 more | 2005-05-17 |
| 6808612 | Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio | Byung Sung Kwak | 2004-10-26 |
| 6635157 | Electro-chemical deposition system | Yezdi Dordi, Donald Olgado, Ratson Morad, Mark Denome, Michael Sugarman +10 more | 2003-10-21 |
| 6500734 | Gas inlets for wafer processing chamber | Roger N. Anderson, David K. Carlson, Mahalingam Venkatesan, Norma Riley | 2002-12-31 |
| 6494219 | Apparatus with etchant mixing assembly for removal of unwanted electroplating deposits | Radha Nayak, Yezdi Dordi, Joseph Stevens | 2002-12-17 |
| 6436267 | Method for achieving copper fill of high aspect ratio interconnect features | Daniel Carl, Barry Chin, Liang-Yuh Chen, Robin Cheung, Peijun Ding +3 more | 2002-08-20 |
| 6258223 | In-situ electroless copper seed layer enhancement in an electroplating system | Robin Cheung, Daniel Carl, Yezdi Dordi, Ratson Morad, Liang-Yuh Chen +2 more | 2001-07-10 |
| 6258220 | Electro-chemical deposition system | Yezdi Dordi, Donald Olgado, Ratson Morad, Mark Denome, Michael Sugarman +10 more | 2001-07-10 |
| 5916369 | Gas inlets for wafer processing chamber | Roger N. Anderson, David K. Carlson, Mahalingam Venkatesan, Norma Riley | 1999-06-29 |