Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for achieving copper fill of high aspect ratio interconnect features

Method for achieving copper fill of high aspect ratio interconnect features

US Patent 6436267 · Granted Aug 20, 2002

Estimated economic value: $16,370,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Oil-water separation device2025
Magnetic thin film laminated structure and micro-inductive device thereof2025
System and process with assisted gas flow inside a reaction chamber2025
Coal rock three-dimensional strain field visual system and method under mining i2025
Battery module2025
System with power jet modules and method thereof2025
Automatic scanning system for tunnel walls constructed by open-type TBM2025
Processing system and method for producing a particulate material2024
Material pushing apparatus and charging method thereof, and material pushing mac2024
Materials and methods of producing lithium cobalt oxide materials of a battery c2024
Method for manufacturing double-layer fair mugs2024
Method for quickly optimizing key mining parameters of outburst coal seam2024