| 8229587 |
Semiconductor fabrication facility visualization system with performance optimization |
Karl Shieh, Michael A. Cookson, Donald R. Wright, Joseph J. Fatula, Jr. |
2012-07-24 |
|
| 7515049 |
Extended read range RFID system |
Arun Sharma, Daniel Fritschen, Daniel Liu |
2009-04-07 |
$704,000 |
| 7290813 |
Active edge grip rest pad |
Anthony C. Bonora, Roger G. Hine, D. Wayne Nobles, Jr. |
2007-11-06 |
$1,947,000 |
| 6833322 |
Apparatuses and methods for depositing an oxide film |
Roger N. Anderson, Paul B. Comita, Ann Waldhauer |
2004-12-21 |
$24,351,000 |
| 6685779 |
Method and a system for sealing an epitaxial silicon layer on a substrate |
David K. Carlson, Paul B. Comita, Dale R. Du Bois |
2004-02-03 |
$30,271,000 |
| 6562720 |
Apparatus and method for surface finishing a silicon film |
Anna Lena Thilderkvist, Paul B. Comita, Lance A. Scudder |
2003-05-13 |
$26,360,000 |
| 6500734 |
Gas inlets for wafer processing chamber |
Roger N. Anderson, Peter Hey, David K. Carlson, Mahalingam Venkatesan |
2002-12-31 |
$23,154,000 |
| 6489241 |
Apparatus and method for surface finishing a silicon film |
Anna Lena Thilderkvist, Paul B. Comita, Lance A. Scudder |
2002-12-03 |
$24,582,000 |
| 6399510 |
Bi-directional processing chamber and method for bi-directional processing of semiconductor substrates |
Roger N. Anderson, Grant D. Imper, Paul B. Comita |
2002-06-04 |
$34,666,000 |
| 6376387 |
Method of sealing an epitaxial silicon layer on a substrate |
David K. Carlson, Paul B. Comita, Dale R. Du Bois |
2002-04-23 |
$30,581,000 |
| 6366861 |
Method of determining a wafer characteristic using a film thickness monitor |
Ann Waldhauer, Paul B. Comita |
2002-04-02 |
$41,044,000 |
| 6254686 |
Vented lower liner for heating exhaust gas from a single substrate reactor |
Paul B. Comita, David K. Carlson, Doria W. Fan, Rekha Ranganathan |
2001-07-03 |
$77,440,000 |
| 6171966 |
Delineation pattern for epitaxial depositions |
Thomas E. Deacon |
2001-01-09 |
$65,370,000 |
| 6153260 |
Method for heating exhaust gas in a substrate reactor |
Paul B. Comita, David K. Carlson, Doria W. Fan, Rekha Ranganathan |
2000-11-28 |
$69,326,000 |
| 6083323 |
Method for controlling the temperature of the walls of a reaction chamber during processing |
David K. Carlson, Roger N. Anderson |
2000-07-04 |
|
| 5916369 |
Gas inlets for wafer processing chamber |
Roger N. Anderson, Peter Hey, David K. Carlson, Mahalingam Venkatesan |
1999-06-29 |
$90,358,000 |
| 5855677 |
Method and apparatus for controlling the temperature of reaction chamber walls |
David K. Carlson, Roger N. Anderson |
1999-01-05 |
$50,013,000 |
| 5411593 |
Apparatus for servicing vacuum chamber using non-reactive gas filled maintenance enclosure |
David K. Carlson |
1995-05-02 |
$52,072,000 |
| 5322567 |
Particulate reduction baffle with wafer catcher for chemical-vapor-deposition apparatus |
Paul Deaton, James V. Rinnovatore |
1994-06-21 |
$40,644,000 |
| 5316794 |
Method for servicing vacuum chamber using non-reactive gas-filled maintenance enclosure |
David K. Carlson |
1994-05-31 |
$15,561,000 |
| 5298107 |
Processing method for growing thick films |
Lance A. Scudder, Jon M. Schalla |
1994-03-29 |
$21,306,000 |
| 5198071 |
Process for inhibiting slip and microcracking while forming epitaxial layer on semiconductor wafer |
Lance A. Scudder |
1993-03-30 |
$19,676,000 |
