Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8329575 | Fabrication of through-silicon vias on silicon wafers | Nagarajan Rajagopalan, Ji Ae Park, Ryan Yamase, Shamik Patel, Thomas Nowak +5 more | 2012-12-11 |
| 8283237 | Fabrication of through-silicon vias on silicon wafers | Nagarajan Rajagopalan, Ji Ae Park, Ryan Yamase, Shamik Patel, Thomas Nowak +5 more | 2012-10-09 |
| 7294242 | Collimated and long throw magnetron sputtering of nickel/iron films for magnetic recording head applications | Imran Hashim, Seh Kwang Lee, Thomas Brezoczky | 2007-11-13 |
| 6362099 | Method for enhancing the adhesion of copper deposited by chemical vapor deposition | Srinivas Gandikota, Dennis Cong, Liang-Yuh Chen, Daniel Carl | 2002-03-26 |