Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6362099 | Method for enhancing the adhesion of copper deposited by chemical vapor deposition | Srinivas Gandikota, Liang-Yuh Chen, Sesh Ramaswami, Daniel Carl | 2002-03-26 |
DC
Dennis Cong
Overall (All Time): #3,539,013 of 4,157,543Top 90%
1
Patents All Time