Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165881 | Methods and systems of forming metal interconnect layers using engineered templates | — | 2024-12-10 |
| 11756800 | Methods and systems of forming metal interconnect layers using engineered templates | — | 2023-09-12 |
| 11125673 | System and method for characterization of inclusions in liquid samples | — | 2021-09-21 |
| 10705009 | System and method for characterization of inclusions in liquid samples | — | 2020-07-07 |
| 10241024 | System and method for characterization of inclusions in liquid samples | — | 2019-03-26 |
| 7842169 | Method and apparatus for local polishing control | Stan Tsai, Feng Q. Liu, Yan Wang, Liang-Yuh Chen, Alain Duboust | 2010-11-30 |
| 7815787 | Electrolyte retaining on a rotating platen by directional air flow | Hung Chih Chen | 2010-10-19 |
| 7738101 | Systems and methods for in-line monitoring of particles in opaque flows | — | 2010-06-15 |
| 7678245 | Method and apparatus for electrochemical mechanical processing | Yan Wang, Siew Neo, Feng Q. Liu, Stan Tsai, Yongqi Hu +9 more | 2010-03-16 |
| 7670468 | Contact assembly and method for electrochemical mechanical processing | Feng Q. Liu | 2010-03-02 |
| 7608173 | Biased retaining ring | Antoine P. Manens, Feng Q. Liu, Paul D. Butterfield, Alain Duboust | 2009-10-27 |
| 7569134 | Contacts for electrochemical processing | Paul D. Butterfield, Liang-Yuh Chen, Yongqi Hu, Antoine P. Manens, Stan Tsai | 2009-08-04 |
| 7520968 | Conductive pad design modification for better wafer-pad contact | Lakshmanan Karuppiah | 2009-04-21 |
| 7513062 | Single wafer dryer and drying methods | Younes Achkire, Alexander Lerner, Boris Govzman, Boris Fishkin, Michael Sugarman +4 more | 2009-04-07 |
| 7452264 | Pad cleaning method | Hung Chih Chen | 2008-11-18 |
| 7427340 | Conductive pad | Ralph Wadensweiler | 2008-09-23 |
| 7422516 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Stan Tsai +5 more | 2008-09-09 |
| 7407433 | Pad characterization tool | Simon Yavelberg, Gerald Alonzo | 2008-08-05 |
| 7374644 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yongqi Hu, Antoine P. Manens, Stan Tsai +2 more | 2008-05-20 |
| 7375023 | Method and apparatus for chemical mechanical polishing of semiconductor substrates | Stan Tsai, Liang-Yuh Chen, Lizhong Sun, Shijian Li, Feng Q. Liu +2 more | 2008-05-20 |
| 7344432 | Conductive pad with ion exchange membrane for electrochemical mechanical polishing | Liang-Yun Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel Carl +9 more | 2008-03-18 |
| 7311592 | Conductive polishing article for electrochemical mechanical polishing | Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel Carl +4 more | 2007-12-25 |
| 7303662 | Contacts for electrochemical processing | Stan Tsai, Yongqi Hu, Paul D. Butterfield, Antoine P. Manens, Liang-Yuh Chen | 2007-12-04 |
| 7278911 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Stan Tsai +5 more | 2007-10-09 |
| 7232363 | Polishing solution retainer | Hanzhong Zhang, Feng Q. Liu, Stan Tsai, Donald Olgado, Liang-Yuh Chen | 2007-06-19 |