Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12330260 | Polishing pad with secondary window seal | Rajkumar Alagarsamy, Simon Yavelberg, Periya Gopalan, Christopher R. Mahon | 2025-06-17 |
| 11826875 | Window in thin polishing pad | Kadthala Ramaya Narendrnath, Thomas Lawrence Terry | 2023-11-28 |
| 11618124 | Polishing pad with secondary window seal | Rajkumar Alagarsamy, Simon Yavelberg, Periya Gopalan, Christopher R. Mahon | 2023-04-04 |
| 11161218 | Window in thin polishing pad | Kadthala Ramaya Narendrnath, Thomas Lawrence Terry | 2021-11-02 |
| 10744618 | Polishing pad with secondary window seal | Rajkumar Alagarsamy, Simon Yavelberg, Periya Gopalan, Christopher R. Mahon | 2020-08-18 |
| 10399202 | Retaining ring for lower wafer defects | Simon Yavelberg, Gangadhar Sheelavant, Kadthala Ramaya Narendrnath | 2019-09-03 |
| 10213894 | Method of placing window in thin polishing pad | Kadthala Ramaya Narendrnath, Thomas Lawrence Terry | 2019-02-26 |
| 10029346 | External clamp ring for a chemical mechanical polishing carrier head | Patrick Ala, Bo Ding, Simon Yavelberg, Mats Larsson | 2018-07-24 |
| 9744640 | Corrosion resistant retaining rings | Gangadhar Sheelavant, Simon Yavelberg | 2017-08-29 |
| 9731397 | Polishing pad with secondary window seal | Rajkumar Alagarsamy, Simon Yavelberg, Periya Gopalan, Christopher R. Mahon | 2017-08-15 |
| 8961266 | Polishing pad with secondary window seal | Rajkumar Alagarsamy, Simon Yavelberg, Periya Gopalan, Christopher R. Mahon | 2015-02-24 |
| 7699972 | Method and apparatus for evaluating polishing pad conditioning | Zhihong Wang, Stan Tsai | 2010-04-20 |
| 7678245 | Method and apparatus for electrochemical mechanical processing | Yan Wang, Siew Neo, Feng Q. Liu, Stan Tsai, Alain Duboust +9 more | 2010-03-16 |
| 7582564 | Process and composition for conductive material removal by electrochemical mechanical polishing | Zhihong Wang, You Wang, Daxin Mao, Renhe Jia, Stan Tsai +2 more | 2009-09-01 |
| 7576007 | Method for electrochemically mechanically polishing a conductive material on a substrate | You Wang, Zhihong Wang, Renhe Jia, Stan Tsai | 2009-08-18 |
| 7569134 | Contacts for electrochemical processing | Paul D. Butterfield, Liang-Yuh Chen, Antoine P. Manens, Rashid Mavliev, Stan Tsai | 2009-08-04 |
| 7446041 | Full sequence metal and barrier layer electrochemical mechanical processing | Feng Q. Liu, Liang-Yuh Chen, Stan Tsai | 2008-11-04 |
| 7374644 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Antoine P. Manens, Rashid Mavliev, Stan Tsai +2 more | 2008-05-20 |
| 7344431 | Pad assembly for electrochemical mechanical processing | Stan Tsai, Yan Wang, Feng Q. Liu, Shou-Sung Chang, Liang-Yuh Chen | 2008-03-18 |
| 7323416 | Method and composition for polishing a substrate | Feng Q. Liu, Tianbao Du, Alain Duboust, Yan Wang, Stan Tsai +3 more | 2008-01-29 |
| 7303662 | Contacts for electrochemical processing | Rashid Mavliev, Stan Tsai, Paul D. Butterfield, Antoine P. Manens, Liang-Yuh Chen | 2007-12-04 |
| 7232514 | Method and composition for polishing a substrate | Feng Q. Liu, Stan Tsai, Siew Neo, Yan Wang, Alain Duboust +1 more | 2007-06-19 |
| 7229535 | Hydrogen bubble reduction on the cathode using double-cell designs | Yan Wang, Feng Q. Liu, Alain Duboust, Siew Neo, Liang-Yuh Chen | 2007-06-12 |
| 7210988 | Method and apparatus for reduced wear polishing pad conditioning | Yan Wang, Stan Tsai, Feng Q. Liu, Liang-Yuh Chen, Daxin Mao +4 more | 2007-05-01 |
| 7207878 | Conductive polishing article for electrochemical mechanical polishing | Yan Wang, Alain Duboust, Feng Q. Liu, Antoine P. Manens, Siew Neo +5 more | 2007-04-24 |