| 10414947 |
Polishing composition containing ceria particles and method of use |
Brian Reiss, Viet Lam |
2019-09-17 |
$5,680,000 |
| 9850402 |
CMP compositions and methods for selective removal of silicon nitride |
Dmitry Dinega, Sairam Shekhar, Daniel Mateja |
2017-12-26 |
$8,256,000 |
| 9828528 |
Polishing composition containing ceria abrasive |
Brian Reiss, Dana Sauter Van Ness, Viet Lam, Alexander W. Hains, Steven Kraft |
2017-11-28 |
$7,737,000 |
| 9758697 |
Polishing composition containing cationic polymer additive |
Brian Reiss, Dana Sauter Van Ness, Viet Lam |
2017-09-12 |
$13,700,000 |
| 9505952 |
Polishing composition containing ceria abrasive |
Brian Reiss, Dana Sauter Van Ness, Viet Lam, Alexander W. Hains, Steven Kraft |
2016-11-29 |
$15,937,000 |
| 9434859 |
Chemical-mechanical planarization of polymer films |
Sudeep Pallikkara Kuttiatoor, Jeffrey Dysard |
2016-09-06 |
$20,294,000 |
| 9422455 |
CMP compositions exhibiting reduced dishing in STI wafer polishing |
Sudeep Pallikkara Kuttiatoor, Kevin P. Dockery, Prativa PANDEY |
2016-08-23 |
$5,125,000 |
| 9340706 |
Mixed abrasive polishing compositions |
Brian Reiss, Jakub W. Nalaskowski, Viet Lam, Jeffrey Dysard |
2016-05-17 |
$8,405,000 |
| 9165489 |
CMP compositions selective for oxide over polysilicon and nitride with high removal rate and low defectivity |
Tina Li, Kevin P. Dockery, Jeffrey Dysard |
2015-10-20 |
$12,620,000 |
| 8906252 |
CMP compositions selective for oxide and nitride with high removal rate and low defectivity |
Kevin P. Dockery, Jeffrey Dysard |
2014-12-09 |
|
| 8864915 |
Cleaning methods for improved photovoltaic module efficiency |
Adam Brand, Liming Zhang, Dapeng Wang, Tzay-Fa Su, Vijay Parihar |
2014-10-21 |
$32,207,000 |
| 7879255 |
Method and composition for electrochemically polishing a conductive material on a substrate |
Huyen Karen Tran, You Wang, Stan Tsai, Martin S. Wohlert, Daxin Mao |
2011-02-01 |
$7,897,000 |
| 7582564 |
Process and composition for conductive material removal by electrochemical mechanical polishing |
Zhihong Wang, You Wang, Daxin Mao, Stan Tsai, Yongqi Hu +2 more |
2009-09-01 |
$35,895,000 |
| 7576007 |
Method for electrochemically mechanically polishing a conductive material on a substrate |
You Wang, Zhihong Wang, Stan Tsai, Yongqi Hu |
2009-08-18 |
$17,494,000 |
| 7504018 |
Electrochemical method for Ecmp polishing pad conditioning |
You Wang, Stan Tsai, Lakshmanan Karuppiah, Jie Diao, Alpay Yilmaz |
2009-03-17 |
$10,205,000 |
| 7390744 |
Method and composition for polishing a substrate |
Feng Q. Liu, Stan Tsai, Liang-Yuh Chen |
2008-06-24 |
$46,686,000 |
| 7344432 |
Conductive pad with ion exchange membrane for electrochemical mechanical polishing |
Liang-Yun Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel Carl +9 more |
2008-03-18 |
$36,315,000 |
| 7210988 |
Method and apparatus for reduced wear polishing pad conditioning |
Yan Wang, Stan Tsai, Yongqi Hu, Feng Q. Liu, Liang-Yuh Chen +4 more |
2007-05-01 |
$22,949,000 |
