Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › CMP compositions selective for oxide and nitride with high removal rate and low defectivity

CMP compositions selective for oxide and nitride with high removal rate and low defectivity

US Patent 8906252 · Granted Dec 9, 2014

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Composition for tungsten CMP2025
CMP composition including an anionic abrasive2025
CMP composition including a novel abrasive2023
Derivatized polyamino acids2022
Surface treated abrasive particles for tungsten buff applications2021
Polishing composition and method utilizing abrasive particles treated with an am2021
Composition for tungsten CMP2020
Tungsten buff polishing compositions with improved topography2020
CMP compositions selective for oxide and nitride with improved dishing and patte2020
Polishing composition and method utilizing abrasive particles treated with an am2019
Polishing composition containing ceria particles and method of use2019
Tungsten processing slurry with catalyst2018