Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electrochemical method for Ecmp polishing pad conditioning

Electrochemical method for Ecmp polishing pad conditioning

US Patent 7504018 · Granted Mar 17, 2009

Estimated economic value: $10,205,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Modular mainframe layout for supporting multiple semiconductor process modules o2025
Modular mainframe layout for supporting multiple semiconductor process modules o2024
Modular mainframe layout for supporting multiple semiconductor process modules o2024
Polishing pads for high temperature processing2024
In-situ metrology and process control2024
Low-temperature metal CMP for minimizing dishing and corrosion, and improving pa2024
Retaining ring for CMP2023
In-situ metrology and process control2022
Contact structures2022
Systems and methods for copper (I) suppression in electrochemical deposition2021
Glass surface stress meter and multiple-tempered glass surface stress meter2021
Thin plastic polishing article for CMP applications2020