Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7160432 | Method and composition for polishing a substrate | Feng Q. Liu, Liang-Yuh Chen, Stan Tsai, Alain Duboust, Siew Neo +2 more | 2007-01-09 |
| 7128825 | Method and composition for polishing a substrate | Feng Q. Liu, Stan Tsai, Siew Neo, Yan Wang, Alain Duboust +1 more | 2006-10-31 |
| 7125477 | Contacts for electrochemical processing | Paul D. Butterfield, Liang-Yuh Chen, Antoine P. Manens, Rashid Mavliev, Stan Tsai | 2006-10-24 |
| 7084064 | Full sequence metal and barrier layer electrochemical mechanical processing | Feng Q. Liu, Liang-Yuh Chen, Stan Tsai | 2006-08-01 |
| 7077721 | Pad assembly for electrochemical mechanical processing | Stan Tsai, Yan Wang, Feng Q. Liu, Shou-Sung Chang, Liang-Yuh Chen | 2006-07-18 |
| 6991528 | Conductive polishing article for electrochemical mechanical polishing | Yan Wang, Alain Duboust, Feng Q. Liu, Antoine P. Manens, Siew Neo +5 more | 2006-01-31 |
| 6979248 | Conductive polishing article for electrochemical mechanical polishing | Yan Wang, Alain Duboust, Feng Q. Liu, Rashid Mavliev, Liang-Yuh Chen +2 more | 2005-12-27 |
| 6960521 | Method and apparatus for polishing metal and dielectric substrates | Yongsik Moon, David H. Mai, Kapila Wijekoon, Rajeev Bajaj, Rahul Surana +6 more | 2005-11-01 |
| 6790768 | Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects | Yongsik Moon, David H. Mai, Kapila Wijekoon, Rajeev Bajaj, Rahul Surana +6 more | 2004-09-14 |
| 6709314 | Chemical mechanical polishing endpoinat detection | Tony Kaushal, Chuong Q. Dam | 2004-03-23 |