Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362188 | Method for preventing line bending during metal fill process | Adam Jandl, Sema Ermez, Lawrence Schloss, Sanjay Gopinath, Michal Danek +2 more | 2025-07-15 |
| 11355345 | Method for preventing line bending during metal fill process | Adam Jandl, Sema Ermez, Lawrence Schloss, Sanjay Gopinath, Michal Danek +2 more | 2022-06-07 |
| 11225712 | Atomic layer deposition of tungsten for enhanced fill and reduced substrate attack | Joshua Collins, Hanna Bamnolker, Kapil Sawlani | 2022-01-18 |
| 10573522 | Method for preventing line bending during metal fill process | Adam Jandl, Sema Ermez, Lawrence Schloss, Sanjay Gopinath, Michal Danek +2 more | 2020-02-25 |
| 10337087 | Off-axis epitaxial lift off process | Thomas J. Gmitter, Gang He, Melissa Archer | 2019-07-02 |
| 10214807 | Atomic layer deposition of tungsten for enhanced fill and reduced substrate attack | Joshua Collins, Hanna Bamnolker, Kapil Sawlani | 2019-02-26 |
| 9994936 | Off-axis epitaxial lift off process | Thomas J. Gmitter, Gang He, Melissa Archer | 2018-06-12 |
| 8066552 | Multi-layer polishing pad for low-pressure polishing | Alain Duboust, Shou-Sung Chang, Wei Lu, Yan Wang, Antoine P. Manens +1 more | 2011-11-29 |
| 7790015 | Endpoint for electroprocessing | Yan Wang, Antoine P. Manens, Alain Duboust, Liang-Yuh Chen | 2010-09-07 |
| 7678245 | Method and apparatus for electrochemical mechanical processing | Yan Wang, Feng Q. Liu, Stan Tsai, Yongqi Hu, Alain Duboust +9 more | 2010-03-16 |
| 7628905 | Algorithm for real-time process control of electro-polishing | Antoine P. Manens, Alain Duboust, Liang-Yuh Chen | 2009-12-08 |
| 7422516 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev +5 more | 2008-09-09 |
| 7384534 | Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP | Lizhong Sun, Feng Q. Liu, Stan Tsai, Liang-Yuh Chen | 2008-06-10 |
| 7278911 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev +5 more | 2007-10-09 |
| 7232514 | Method and composition for polishing a substrate | Feng Q. Liu, Stan Tsai, Yongqi Hu, Yan Wang, Alain Duboust +1 more | 2007-06-19 |
| 7229535 | Hydrogen bubble reduction on the cathode using double-cell designs | Yan Wang, Feng Q. Liu, Alain Duboust, Liang-Yuh Chen, Yongqi Hu | 2007-06-12 |
| 7207878 | Conductive polishing article for electrochemical mechanical polishing | Yongqi Hu, Yan Wang, Alain Duboust, Feng Q. Liu, Antoine P. Manens +5 more | 2007-04-24 |
| 7160432 | Method and composition for polishing a substrate | Feng Q. Liu, Liang-Yuh Chen, Stan Tsai, Alain Duboust, Yongqi Hu +2 more | 2007-01-09 |
| 7128825 | Method and composition for polishing a substrate | Feng Q. Liu, Stan Tsai, Yongqi Hu, Yan Wang, Alain Duboust +1 more | 2006-10-31 |
| 7112270 | Algorithm for real-time process control of electro-polishing | Antoine P. Manens, Alain Duboust, Liang-Yuh Chen | 2006-09-26 |
| 6991528 | Conductive polishing article for electrochemical mechanical polishing | Yongqi Hu, Yan Wang, Alain Duboust, Feng Q. Liu, Antoine P. Manens +5 more | 2006-01-31 |
| 6991526 | Control of removal profile in electrochemically assisted CMP | Lizhong Sun, Liang-Yuh Chen, Feng Q. Liu, Alain Duboust, Stan Tsai +1 more | 2006-01-31 |
| 6962524 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev +5 more | 2005-11-08 |
| 6899804 | Electrolyte composition and treatment for electrolytic chemical mechanical polishing | Alain Duboust, Lizhong Sun, Feng Q. Liu, Yuchun Wang, Yan Wang +1 more | 2005-05-31 |
| 6863797 | Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP | Lizhong Sun, Feng Q. Liu, Stan Tsai, Liang-Yuh Chen | 2005-03-08 |