Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362188 | Method for preventing line bending during metal fill process | Adam Jandl, Sema Ermez, Lawrence Schloss, Michal Danek, Siew Neo +2 more | 2025-07-15 |
| 12237221 | Nucleation-free tungsten deposition | Sema Ermez, Ruopeng Deng, Yutaka Nishioka, Xiaolan Ba, Michal Danek | 2025-02-25 |
| 12203168 | Metal deposition | Ravi Vellanki, Eric H. Lenz, Vinayakaraddy Gulabal, Michal Danek, Prodyut Majumder +5 more | 2025-01-21 |
| 12077858 | Tungsten deposition | Pragna Nannapaneni, Novy Tjokro, Sema Ermez, Ruopeng Deng, Tianhua Yu +1 more | 2024-09-03 |
| 12060639 | Rapid flush purging during atomic layer deposition | Pragna Nannapaneni, Sema Ermez, Novy Tjokro, Ruopeng Deng, Tianhua Yu +2 more | 2024-08-13 |
| 12014928 | Multi-layer feature fill | Xiaolan Ba, Ruopeng Deng, Juwen Gao, Lawrence Schloss | 2024-06-18 |
| 11355345 | Method for preventing line bending during metal fill process | Adam Jandl, Sema Ermez, Lawrence Schloss, Michal Danek, Siew Neo +2 more | 2022-06-07 |
| 11348795 | Metal fill process for three-dimensional vertical NAND wordline | Lawrence Schloss, Raashina Humayun, Juwen Gao, Michal Danek, Kaihan Ashtiani | 2022-05-31 |
| 10573522 | Method for preventing line bending during metal fill process | Adam Jandl, Sema Ermez, Lawrence Schloss, Michal Danek, Siew Neo +2 more | 2020-02-25 |
| 9484251 | Contact integration for reduced interface and series contact resistance | Paul R. Besser, William Crew | 2016-11-01 |
| 9478411 | Method to tune TiOx stoichiometry using atomic layer deposited Ti film to minimize contact resistance for TiOx/Ti based MIS contact scheme for CMOS | Shruti Vivek Thombare, Ishtak Karim, Reza Arghavani, Michal Danek | 2016-10-25 |
| 9478438 | Method and apparatus to deposit pure titanium thin film at low temperature using titanium tetraiodide precursor | Shruti Vivek Thombare, Ishtak Karim, Michal Danek | 2016-10-25 |
| 9447499 | Dual plenum, axi-symmetric showerhead with edge-to-center gas delivery | Shambhu N. Roy, Vincent E. Burkhart, Natan Solomon, Kaihan Ashtiani, Bart van Schravendijk +3 more | 2016-09-20 |
| 9349637 | Method for void-free cobalt gap fill | Jeong-Seok Na, Tianhua Yu, Michal Danek | 2016-05-24 |
| 9255326 | Systems and methods for remote plasma atomic layer deposition | Jeong-Seok Na | 2016-02-09 |
| 9117884 | Conformal films on semiconductor substrates | Roey Shaviv, Peter John Holverson, Anshu A. Pradhan | 2015-08-25 |
| 8298933 | Conformal films on semiconductor substrates | Roey Shaviv, Peter John Holverson, Anshu A. Pradhan | 2012-10-30 |
| 7503334 | Apparatus and methods for processing semiconductor substrates using supercritical fluids | Krishnan Shrinivasan, Souvik Banerjee, Francisco Juarez, Karen A. Reinhardt | 2009-03-17 |
| 7456101 | Method for enhancing the nucleation and morphology of ruthenium films on dielectric substrates using amine containing compounds | Jeremie J. Dalton, Jason M. Blackburn, John Drewery, Willibrordus Gerardus Maria van den Hoek | 2008-11-25 |
| 7279417 | Use of metallocenes to inhibit copper oxidation during semiconductor processing | Jeremie J. Dalton, Jason M. Blackburn | 2007-10-09 |
| 7211509 | Method for enhancing the nucleation and morphology of ruthenium films on dielectric substrates using amine containing compounds | Jeremie J. Dalton, Jason M. Blackburn, John Drewery, Willibrordus Gerardus Maria van den Hoek | 2007-05-01 |
| 7041596 | Surface treatment using iodine plasma to improve metal deposition | Jeremie J. Dalton, Jason M. Blackburn, John Drewery | 2006-05-09 |
| 7037574 | Atomic layer deposition for fabricating thin films | Ajit Paranjpe, Thomas R. Omstead, Randhir Bubber, Ming Mao | 2006-05-02 |
| 6951765 | Method and apparatus for introduction of solid precursors and reactants into a supercritical fluid reactor | Patrick A. Van Cleemput, Michelle T. Schulberg, Sasangan Ramanathan, Francisco Juarez, Patrick Joyce | 2005-10-04 |
| 6848458 | Apparatus and methods for processing semiconductor substrates using supercritical fluids | Krishnan Shrinivasan, Souvik Banerjee, Francisco Juarez, Karen A. Reinhardt | 2005-02-01 |