Issued Patents All Time
Showing 1–25 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12172264 | Carrier head membrane with regions of different roughness | Young J. Paik, Ashish Bhatnagar | 2024-12-24 |
| 11826875 | Window in thin polishing pad | Yongqi Hu, Thomas Lawrence Terry | 2023-11-28 |
| 11738421 | Method of making carrier head membrane with regions of different roughness | Young J. Paik, Ashish Bhatnagar | 2023-08-29 |
| 11569069 | 3D printed chamber components configured for lower film stress and lower operating temperature | Govinda Raj, Goichi Yoshidome, Bopanna Ichettira VASANTHA, Umesh M. Kelkar | 2023-01-31 |
| 11417561 | Edge ring for a substrate processing chamber | Govinda Raj, Bopanna Ichettira VASANTHA, Simon Yavelberg | 2022-08-16 |
| 11179965 | Electrostatic chuck optimized for refurbishment | Vijay D. Parkhe | 2021-11-23 |
| 11161218 | Window in thin polishing pad | Yongqi Hu, Thomas Lawrence Terry | 2021-11-02 |
| 11007619 | Carrier head membrane with regions of different roughness | Young J. Paik, Ashish Bhatnagar | 2021-05-18 |
| 10777391 | 3D printed chamber components configured for lower film stress and lower operating temperature | Govinda Raj, Goichi Yoshidome, Bopanna Ichettira VASANTHA, Umesh M. Kelkar | 2020-09-15 |
| 10636690 | Laminated top plate of a workpiece carrier in micromechanical and semiconductor processing | — | 2020-04-28 |
| 10553473 | Edge ring for a substrate processing chamber | Govinda Raj, Bopanna Ichettira VASANTHA, Simon Yavelberg | 2020-02-04 |
| 10399202 | Retaining ring for lower wafer defects | Yongqi Hu, Simon Yavelberg, Gangadhar Sheelavant | 2019-09-03 |
| 10213894 | Method of placing window in thin polishing pad | Yongqi Hu, Thomas Lawrence Terry | 2019-02-26 |
| 10177014 | Thermal radiation barrier for substrate processing chamber components | Govinda Raj, Daniel L. Martin, Robert T. Hirahara, Ashish Bhatnagar, Bopanna Vasanth +1 more | 2019-01-08 |
| 10160093 | Carrier head membrane roughness to control polishing rate | Young J. Paik, Ashish Bhatnagar | 2018-12-25 |
| 10131126 | Methods for bonding substrates | Gangadhar Sheelavant, Monika Agarwal, Ashish Bhatnagar | 2018-11-20 |
| 10056284 | Electrostatic chuck optimized for refurbishment | Vijay D. Parkhe | 2018-08-21 |
| 10005025 | Corrosion resistant abatement system | Govinda Raj, Monika Agarwal, Hamid Mohiuddin | 2018-06-26 |
| 9993907 | Printed chemical mechanical polishing pad having printed window | Laxman Murugesh | 2018-06-12 |
| 9716012 | Methods of selective layer deposition | David Thompson, Huixiong Dai, Patrick M. Martin, Timothy Michaelson, Robert Jan Visser +2 more | 2017-07-25 |
| 9685356 | Substrate support assembly having metal bonded protective layer | Vijay D. Parkhe | 2017-06-20 |
| 9669653 | Electrostatic chuck refurbishment | Vijay D. Parkhe | 2017-06-06 |
| 9627231 | Methods for bonding substrates | Gangadhar Sheelavant, Monika Agarwal, Ashish Bhatnagar | 2017-04-18 |
| 9613846 | Pad design for electrostatic chuck surface | Govinda Raj, Cheng-Hsiung Tsai, Robert T. Hirahara, Manjunatha Koppa, Ross Marshall | 2017-04-04 |
| 9202736 | Method for refurbishing an electrostatic chuck with reduced plasma penetration and arcing | Dmitry Lubomirsky, Xinglong Chen, Sudhir Gondhalekar, Muhammad M. Rasheed, Tony Kaushal | 2015-12-01 |