Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424413 | Substrate support with real time force and film stress control | Wendell Glenn Boyd, Jr., Matthew J. Busche | 2025-09-23 |
| 12309888 | Heated substrate support | — | 2025-05-20 |
| 12198967 | Substrate support designs for a deposition chamber | Kaushik RAO, Anubhav Srivastava, Santhosh Kumar PILLAPPA | 2025-01-14 |
| 12027388 | Conical coil for rapid thermal anneal lamps | Vilen K. NESTOROV, Kaushik RAO | 2024-07-02 |
| 11915913 | Substrate support with real time force and film stress control | Wendell Glenn Boyd, Jr., Matthew J. Busche | 2024-02-27 |
| 11761901 | Apparatus and method for inspecting lamps | Vilen K. NESTOROV | 2023-09-19 |
| 11694879 | Component, method of manufacturing the component, and method of cleaning the component | Ian Widlow, Gary Urban Keppers, Aravind Dugganna Naik, Francisco Rodarte, Sudhir Gondhalekar +1 more | 2023-07-04 |
| 11676802 | Substrate support with real time force and film stress control | Wendell Glenn Boyd, Jr., Matthew J. Busche | 2023-06-13 |
| 11569069 | 3D printed chamber components configured for lower film stress and lower operating temperature | Kadthala Ramaya Narendrnath, Goichi Yoshidome, Bopanna Ichettira VASANTHA, Umesh M. Kelkar | 2023-01-31 |
| 11560913 | Brazed joint and semiconductor processing chamber component having the same | Tom K. Cho, Hamid Mohiuddin, Ian Widlow | 2023-01-24 |
| 11460413 | Apparatus and method for inspecting lamps | Vilen K. NESTOROV | 2022-10-04 |
| 11417561 | Edge ring for a substrate processing chamber | Kadthala Ramaya Narendrnath, Bopanna Ichettira VASANTHA, Simon Yavelberg | 2022-08-16 |
| 11330673 | Heated substrate support | — | 2022-05-10 |
| 11114326 | Substrate chucking and dechucking methods | Wendell Glenn Boyd, Jr., Jim Zhongyi He, Ramesh Gopalan, Robert T. Hirahara | 2021-09-07 |
| 11054317 | Method and apparatus for direct measurement of chucking force on an electrostatic chuck | Charles G. Potter, Wendell Glenn Boyd, Jr., Robert T. Hirahara | 2021-07-06 |
| 10879046 | Substrate support with real time force and film stress control | Wendell Glen Boyd, Jr., Matthew J. Busche | 2020-12-29 |
| 10777391 | 3D printed chamber components configured for lower film stress and lower operating temperature | Kadthala Ramaya Narendrnath, Goichi Yoshidome, Bopanna Ichettira VASANTHA, Umesh M. Kelkar | 2020-09-15 |
| 10662529 | Cooled gas feed block with baffle and nozzle for HDP-CVD | Hanish Kumar, Lin Zhang, Stanley Wu | 2020-05-26 |
| 10648788 | Substrate distance monitoring | Wendell Glenn Boyd, Jr. | 2020-05-12 |
| 10553473 | Edge ring for a substrate processing chamber | Kadthala Ramaya Narendrnath, Bopanna Ichettira VASANTHA, Simon Yavelberg | 2020-02-04 |
| 10515843 | Amalgamated cover ring | Hanish Kumar Panavalappil Kumarankutty, Stanley Wu | 2019-12-24 |
| 10290459 | Magnetron having enhanced cooling characteristics | Simon Yavelberg, Ramprakash Sankarakrishnan | 2019-05-14 |
| 10190701 | Corrosion control for chamber components | Hanish Kumar, Lin Zhang, Stanley Wu | 2019-01-29 |
| 10177014 | Thermal radiation barrier for substrate processing chamber components | Daniel L. Martin, Robert T. Hirahara, Ashish Bhatnagar, Bopanna Vasanth, Prashanth Rao +1 more | 2019-01-08 |
| 10168229 | EMI/RF shielding of thermocouples | Bopanna Ichettria Vasantha, Ashish Bhatnagar, Cariappa Baduvamanda | 2019-01-01 |