Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114326 | Substrate chucking and dechucking methods | Wendell Glenn Boyd, Jr., Ramesh Gopalan, Robert T. Hirahara, Govinda Raj | 2021-09-07 |
| 11114327 | ESC substrate support with chucking force control | Wendell Glenn Boyd, Jr., Zhenwen Ding | 2021-09-07 |
| 10654147 | Polishing of electrostatic substrate support geometries | Wendell Glenn Boyd, Jr. | 2020-05-19 |
| 9805914 | Methods for removing contamination from surfaces in substrate processing systems | Chun YAN, Xinyu BAO, Teng-Fang Kuo, Zhenwen Ding, Adam Lane | 2017-10-31 |
| 9472416 | Methods of surface interface engineering | Ping Han Hsieh, Melitta Hon, Chun YAN, Xuefeng Hua | 2016-10-18 |
| 8475625 | Apparatus for etching high aspect ratio features | Sharma Pamarthy, Huutri Dao, Xiaoping Zhou, Kelly A. McDonough, Jivko Dinev +9 more | 2013-07-02 |
| 7718081 | Techniques for the use of amorphous carbon (APF) for various etch and litho integration schemes | Wei Liu, Sang-Hoon Ahn, Meihua Shen, Hichem M'Saad, Wendy H. Yeh +1 more | 2010-05-18 |
| 7064078 | Techniques for the use of amorphous carbon (APF) for various etch and litho integration scheme | Wei Liu, Sang-Hoon Ahn, Meihua Shen, Hichem M'Saad, Wendy H. Yeh +1 more | 2006-06-20 |