Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033875 | Wireless in-situ real-time measurement of electrostatic chucking force in semiconductor wafer processing | — | 2024-07-09 |
| 11521839 | Inline measurement of process gas dissociation using infrared absorption | Siamak Salimian | 2022-12-06 |
| 11373890 | Wireless in-situ real-time measurement of electrostatic chucking force in semiconductor wafer processing | — | 2022-06-28 |
| 11355325 | Methods and systems for monitoring input power for process control in semiconductor process systems | Hemant P. Mungekar, Guomin Mao, Rongping Wang, Teryl Pratt | 2022-06-07 |
| 11114326 | Substrate chucking and dechucking methods | Wendell Glenn Boyd, Jr., Jim Zhongyi He, Robert T. Hirahara, Govinda Raj | 2021-09-07 |
| 11047035 | Protective yttria coating for semiconductor equipment parts | Yixing Lin, Tasnuva Tabassum, Siamak Salimian, Yikai Chen, Kevin A. PAPKE | 2021-06-29 |
| 10685819 | Measuring concentrations of radicals in semiconductor processing | Tom K. Cho, George Alajajian, Michael J. Mark | 2020-06-16 |
| 10656100 | Surface acoustic wave sensors in semiconductor processing equipment | Simon Yavelberg, Zubin Huang | 2020-05-19 |
| 10513008 | Chemical mechanical polishing smart ring | Zubin Huang, Stephen A. Wells, Gangadhar Sheelavant, Simon Yavelberg | 2019-12-24 |
| 10415251 | Skylight with compound parabolic diffusers | — | 2019-09-17 |
| 10094788 | Surface acoustic wave sensors in semiconductor processing equipment | Simon Yavelberg, Zubin Huang | 2018-10-09 |
| 7690966 | Method and apparatus for detecting planarization of metal films prior to clearing | Sridharan Srivatsan, Katgenhalli Y. Ramanujam, Tom Ni, Conan Chiang | 2010-04-06 |
| 7413988 | Method and apparatus for detecting planarization of metal films prior to clearing | Sridharan Srivatsan, Katgenhalli Y. Ramanujam, Tom Ni, Conan Chiang | 2008-08-19 |
| 7040952 | Method for reducing or eliminating de-lamination of semiconductor wafer film layers during a chemical mechanical planarization process | Sridharan Srivatsan, K. Y. Ramanujam | 2006-05-09 |