RG

Ramesh Gopalan

Applied Materials: 10 patents #1,290 of 7,310Top 20%
Lam Research: 3 patents #812 of 2,128Top 40%
Overall (All Time): #339,219 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12033875 Wireless in-situ real-time measurement of electrostatic chucking force in semiconductor wafer processing 2024-07-09
11521839 Inline measurement of process gas dissociation using infrared absorption Siamak Salimian 2022-12-06
11373890 Wireless in-situ real-time measurement of electrostatic chucking force in semiconductor wafer processing 2022-06-28
11355325 Methods and systems for monitoring input power for process control in semiconductor process systems Hemant P. Mungekar, Guomin Mao, Rongping Wang, Teryl Pratt 2022-06-07
11114326 Substrate chucking and dechucking methods Wendell Glenn Boyd, Jr., Jim Zhongyi He, Robert T. Hirahara, Govinda Raj 2021-09-07
11047035 Protective yttria coating for semiconductor equipment parts Yixing Lin, Tasnuva Tabassum, Siamak Salimian, Yikai Chen, Kevin A. PAPKE 2021-06-29
10685819 Measuring concentrations of radicals in semiconductor processing Tom K. Cho, George Alajajian, Michael J. Mark 2020-06-16
10656100 Surface acoustic wave sensors in semiconductor processing equipment Simon Yavelberg, Zubin Huang 2020-05-19
10513008 Chemical mechanical polishing smart ring Zubin Huang, Stephen A. Wells, Gangadhar Sheelavant, Simon Yavelberg 2019-12-24
10415251 Skylight with compound parabolic diffusers 2019-09-17
10094788 Surface acoustic wave sensors in semiconductor processing equipment Simon Yavelberg, Zubin Huang 2018-10-09
7690966 Method and apparatus for detecting planarization of metal films prior to clearing Sridharan Srivatsan, Katgenhalli Y. Ramanujam, Tom Ni, Conan Chiang 2010-04-06
7413988 Method and apparatus for detecting planarization of metal films prior to clearing Sridharan Srivatsan, Katgenhalli Y. Ramanujam, Tom Ni, Conan Chiang 2008-08-19
7040952 Method for reducing or eliminating de-lamination of semiconductor wafer film layers during a chemical mechanical planarization process Sridharan Srivatsan, K. Y. Ramanujam 2006-05-09