Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for reducing or eliminating de-lamination of semiconductor wafer film layers during a chemical mechanical planarization process

Method for reducing or eliminating de-lamination of semiconductor wafer film layers during a chemical mechanical planarization process

US Patent 7040952 · Granted May 9, 2006

Estimated economic value: $7,161,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wireless in-situ real-time measurement of electrostatic chucking force in semico2024
Inline measurement of process gas dissociation using infrared absorption2022
Wireless in-situ real-time measurement of electrostatic chucking force in semico2022
Methods and systems for monitoring input power for process control in semiconduc2022
Substrate chucking and dechucking methods2021
Protective yttria coating for semiconductor equipment parts2021
Measuring concentrations of radicals in semiconductor processing2020
Surface acoustic wave sensors in semiconductor processing equipment2020
Chemical mechanical polishing smart ring2019
Skylight with compound parabolic diffusers2019
Surface acoustic wave sensors in semiconductor processing equipment2018
High lifetime consumable silicon nitride-silicon dioxide plasma processing compo2014