Patents per Year
Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11031273 | Physical vapor deposition (PVD) electrostatic chuck with improved thermal coupling for temperature sensitive processes | Bonnie T. Chia, Tomoharu Matsushita, Cheng-Hsiung Tsai | 2021-06-08 | $87,142,000 |
| 10388532 | Methods and devices using PVD ruthenium | Jothilingam Ramalingam, Jianxin Lei, Xianmin Tang | 2019-08-20 | $26,004,000 |
| 9613846 | Pad design for electrostatic chuck surface | Govinda Raj, Cheng-Hsiung Tsai, Robert T. Hirahara, Kadthala Ramaya Narendrnath, Manjunatha Koppa | 2017-04-04 | $16,159,000 |
| 7732327 | Vapor deposition of tungsten materials | Sang-Hyeob Lee, Avgerinos V. Gelatos, Kai Wu, Amit Khandelwal, Emily Renuart +2 more | 2010-06-08 | $8,435,000 |