Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6337004 | High adhesion performance roll sputtered strike layer | Kim J. Blackwell, Pei C. Chen, Frank D. Egitto, Allan R. Knoll, Luis J. Matienzo | 2002-01-08 |
| 5525369 | Method for metallizing through holes in thin film substrates, and resulting devices | Kim J. Blackwell, Pei C. Chen, Stephen E. Deliman, Allan R. Knoll, Richard D. Weale | 1996-06-11 |
| 5461203 | Electronic package including lower water content polyimide film | Kim J. Blackwell, Pei C. Chen, Frank D. Egitto, Allan R. Knoll, Luis J. Matienzo | 1995-10-24 |
| 5288541 | Method for metallizing through holes in thin film substrates, and resulting devices | Kim J. Blackwell, Pei C. Chen, Stephen E. Deliman, Allan R. Knoll, Richard D. Weale | 1994-02-22 |