Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6235411 | Process for coating a substrate with metallic layer | Kim J. Blackwell, Pei C. Chen, Allan R. Knoll, Luis J. Matienzo | 2001-05-22 |
| 5525369 | Method for metallizing through holes in thin film substrates, and resulting devices | Kim J. Blackwell, Pei C. Chen, Stephen E. Deliman, Allan R. Knoll, George J. Matarese | 1996-06-11 |
| 5288541 | Method for metallizing through holes in thin film substrates, and resulting devices | Kim J. Blackwell, Pei C. Chen, Stephen E. Deliman, Allan R. Knoll, George J. Matarese | 1994-02-22 |
| 5128008 | Method of forming a microelectronic package having a copper substrate | Pei C. Chen | 1992-07-07 |