SK

Stephen Krasniak

ET Endicott Interconnect Technologies: 4 patents #26 of 87Top 30%
Overall (All Time): #1,253,557 of 4,157,543Top 35%
4
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7307022 Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof Frank D. Egitto, John M. Lauffer, Voya R. Markovich, Luis J. Matienzo 2007-12-11
7163847 Method of making circuitized substrate Timothy Antesberger, James W. Fuller, John J. Konrad, John S. Kresge, Timothy L. Wells 2007-01-16
7091066 Method of making circuitized substrate Timothy Antesberger, James W. Fuller, John J. Konrad, John S. Kresge, Timothy L. Wells 2006-08-15
7084014 Method of making circuitized substrate Timothy Antesberger, James W. Fuller, John J. Konrad, John S. Kresge, Timothy L. Wells 2006-08-01