DC

David V. Caletka

ET Endicott Interconnect Technologies: 4 patents #26 of 87Top 30%
Overall (All Time): #1,236,536 of 4,157,543Top 30%
4
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7875811 High speed interposer Frank D. Egitto 2011-01-25
7629541 High speed interposer Frank D. Egitto 2009-12-08
7510912 Method of making wirebond electronic package with enhanced chip pad design Varaprasad V. Calmidi, Sanjeev Sathe 2009-03-31
7253518 Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same Varaprasad V. Calmidi, Sanjeev Sathe 2007-08-07