Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10302814 | Mechanisms-based fracture model for geomaterials | Tobias Hoeink | 2019-05-28 |
| 6492724 | Structure for reinforcing a semiconductor device to prevent cracking | Michael A. Gaynes, Mark V. Pierson | 2002-12-10 |
| 6488806 | Assembly process for flip chip package having a low stress chip and resulting structure | Timothy F. Carden | 2002-12-03 |
| 6347901 | Solder interconnect techniques | Seungbae Park, Sanjeev Sathe | 2002-02-19 |
| 6224711 | Assembly process for flip chip package having a low stress chip and resulting structure | Timothy F. Carden | 2001-05-01 |
| 6197619 | Method for reinforcing a semiconductor device to prevent cracking | Michael A. Gaynes, Mark V. Pierson | 2001-03-06 |
| 5949682 | Heated circuit assembly tester and method | Gerard Truman Dickinson, James Lee McGinniss, Jr., Ronald F. Tokarz | 1999-09-07 |
| 5838568 | Heated circuit assembly tester and method | Gerard Truman Dickinson, James Lee McGinniss, Jr., Ronald F. Tokarz | 1998-11-17 |
| 5789682 | Circuit board assembly torsion tester and method | Gerard Truman Dickinson, James Lee McGinniss, Jr., Ronald F. Tokarz | 1998-08-04 |
| 5736646 | Circuit board assembly torsion tester and method | Gerard Truman Dickinson, James Lee McGinniss, Jr., Ronald F. Tokarz | 1998-04-07 |
| 5567884 | Circuit board assembly torsion tester and method | Gerard Truman Dickinson, James Lee McGinniss, Jr., Ronald F. Tokarz | 1996-10-22 |