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Resist trim process to define small openings in dielectric layers |
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2010-06-15 |
| 7329582 |
Methods for fabricating a semiconductor device, which include selectively depositing an electrically conductive material |
James Pan, Ming-Ren Lin |
2008-02-12 |
| 6514844 |
Sidewall treatment for low dielectric constant (low K) materials by ion implantation |
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2003-02-04 |
| 6500755 |
Resist trim process to define small openings in dielectric layers |
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2002-12-31 |
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Method of defining small openings in dielectric layers |
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2002-06-18 |
| 6315637 |
Photoresist removal using a polishing tool |
Eric M. Apelgren, Paul R. Besser |
2001-11-13 |
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Dual slurry particle sizes for reducing microscratching of wafers |
Paul R. Besser, Jeremy I. Martin |
2001-09-25 |
| 6261963 |
Reverse electroplating of barrier metal layer to improve electromigration performance in copper interconnect devices |
Larry Zhao, Paul R. Besser, Eric M. Apelgren, Christian Zistl |
2001-07-17 |
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Method of exhaust control for spin-on films with reduced defects |
C. Bradford Hopper |
1999-11-16 |
