RC

Richard W. Carpenter

MI Morton International: 5 patents #86 of 580Top 15%
IBM: 5 patents #18,733 of 70,183Top 30%
MT Microcoating Technologies: 2 patents #7 of 20Top 35%
📍 Johnson City, NY: #7 of 139 inventorsTop 6%
🗺 New York: #10,487 of 115,490 inventorsTop 10%
Overall (All Time): #353,971 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
7884738 Emergency traffic light system Thomas Speros Pappas, Anthony C. Savalle 2011-02-08
6632591 Nanolaminated thin film circuitry materials Andrew Tye Hunt, Wen-Yi Lin 2003-10-14
6500350 Formation of thin film resistors Andrew Tye Hunt, Wen-Yi Lin, Shara S. Shoup, Stephen E. Bottomley, Tzyy Jiuan Hwang +1 more 2002-12-31
6388230 Laser imaging of thin layer electronic circuitry material Wayne E. Nacker 2002-05-14
6356455 Thin integral resistor/capacitor/inductor package, method of manufacture 2002-03-12
6329899 Formation of thin film resistors Andrew Tye Hunt, Wen-Yi Lin, Shara S. Shoup, Stephen E. Bottomley, Tzyy Jiuan Hwang +1 more 2001-12-11
6309805 Method for securing and processing thin film materials 2001-10-30
6210592 Deposition of resistor materials directly on insulating substrates Andrew Tye Hunt, Wen-Yi Lin, Shara S. Shoup 2001-04-03
6212078 Nanolaminated thin film circuitry materials Andrew Tye Hunt, Wen-Yi Lin 2001-04-03
5495665 Process for providing a landless via connection Robert E. Ruane 1996-03-05
5472735 Method for forming electrical connection to the inner layers of a multilayer circuit board Christina M. Boyko, Raymond T. Galasco, Krystyna W. Semkow, Herbert Wegener 1995-12-05
5450290 Printed circuit board with aligned connections and method of making same Christina M. Boyko, Francis J. Bucek, Voya R. Markovich, Darleen Mayo, Cindy M. Reidsema +1 more 1995-09-12
5374338 Selective electroetch of copper and other metals Christina M. Boyko, Raymond T. Galasco, Krystyna W. Semkow, Herbert Wegener 1994-12-20
5103293 Electronic circuit packages with tear resistant organic cores Edward J. Bonafino, Peter Lueck, William J. Summa, David W. Wang 1992-04-07