EB

Edward J. Bonafino

IBM: 1 patents #44,794 of 70,183Top 65%
📍 Endwell, NY: #174 of 267 inventorsTop 70%
🗺 New York: #67,335 of 115,490 inventorsTop 60%
Overall (All Time): #3,847,690 of 4,157,543Top 95%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5103293 Electronic circuit packages with tear resistant organic cores Richard W. Carpenter, Peter Lueck, William J. Summa, David W. Wang 1992-04-07