Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 5495665 | Process for providing a landless via connection | Richard W. Carpenter | 1996-03-05 | $15,621,000 |
| 5316803 | Method for forming electrical interconnections in laminated vias | Russell Thomas White, Jr. | 1994-05-31 | $5,696,000 |
| 5229550 | Encapsulated circuitized power core alignment and lamination | Perminder S. Bindra, Dennis A. Canfield, Voya R. Markovich, Jeffrey McKeveny, Edwin L. Thomas | 1993-07-20 | $7,702,000 |
| 5129142 | Encapsulated circuitized power core alignment and lamination | Perminder S. Bindra, Dennis A. Canfield, Voya R. Markovich, Jeffrey McKeveny, Edwin L. Thomas | 1992-07-14 | $13,053,000 |
| 4918812 | Processing of cores for circuit boards or cards | — | 1990-04-24 | $16,542,000 |